SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF: abstract simplified (18334381)

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  • This abstract for appeared for patent application number 18334381 Titled 'SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF'

Simplified Explanation

This abstract describes a semiconductor structure that consists of three main components: a circuit substrate, a semiconductor die, and a cover. The semiconductor die is placed on top of the circuit substrate. The cover is then placed over both the semiconductor die and the circuit substrate. The cover is made up of two parts: a lid portion and a support portion. The support portion is attached to the circuit substrate using a first adhesive, while the lid portion is attached to the support portion using a second adhesive.


Original Abstract Submitted

A semiconductor structure includes a circuit substrate, a semiconductor die, and a cover. The semiconductor die is disposed on the circuit substrate. The cover is disposed over the semiconductor die and over the circuit substrate. The cover comprises a lid portion and a support portion. The structure includes a first adhesive bonding the support portion to the circuit substrate and a second adhesive bonding the support portion and the lid portion.

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