SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS: abstract simplified (17714147)

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  • This abstract for appeared for patent application number 17714147 Titled 'SEMICONDUCTOR PACKAGE INCLUDING SOIC DIE STACKS'

Simplified Explanation

The abstract describes a semiconductor package that includes an interposer, a stack of two or more System on Integrated Chips (SoIC) bonded to the interposer, and multiple chips bonded to the interposer. The distance between the boundary of the SoIC die stack and the boundary of a neighboring chip is larger than a certain threshold distance in a specific direction.


Original Abstract Submitted

A semiconductor package is provided. The semiconductor package includes: an interposer; a System on Integrated Chips (SoIC) die stack bonded to a top surface of the interposer, the SoIC die stack comprising two or more dies bonded together; and a plurality of chips bonded to the top surface of the interposer. A first lateral distance, in a first direction, between a first boundary of the SoIC die stack and a boundary of a neighboring chip among the plurality of chips is larger than a first threshold distance.

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