SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE: abstract simplified (18326325)

• This abstract for appeared for patent application number 18326325 Titled 'SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE'

Simplified Explanation

The abstract describes a semiconductor package that includes a package substrate and an interposer. The interposer has a semiconductor substrate with a wiring layer on top, which contains multiple wirings. There are redistribution wiring pads on the wiring layer that are connected to the wirings. Bonding pads are placed on the redistribution wiring pads. An insulation layer pattern is also present on the wiring layer, exposing a part of the bonding pad. The interposer also has two semiconductor devices, which are positioned apart from each other and connected by the wirings.

Original Abstract Submitted

A semiconductor package includes a package substrate. An interposer is disposed on the package substrate. The interposer includes a semiconductor substrate, a wiring layer disposed on an upper surface of the semiconductor substrate and having a plurality of wirings therein, redistribution wiring pads disposed on the wiring layer and electrically connected to the wirings, bonding pads disposed on the redistribution wiring pads, and an insulation layer pattern disposed on the wiring layer and exposing at least a portion of the bonding pad, and first and second semiconductor devices disposed on the interposer. The first and second semiconductor devices are spaced apart from each other and are electrically connected to each other by at least one of the wirings.