ROHM CO., LTD. patent applications published on November 30th, 2023

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Summary of the patent applications from ROHM CO., LTD. on November 30th, 2023

ROHM CO., LTD. has recently filed several patents related to semiconductor devices and circuits. These patents cover a wide range of technologies, including transmission circuits, gate voltage correction circuits, switching power supply circuits, power factor correction circuits, terahertz devices, nitride semiconductor devices, and insulated die pads.

In the transmission circuit patent, multiple terminals and variable resistance circuits are described. A controller is used to control the resistance values of the variable resistance circuits based on transmission data.

The semiconductor device patent focuses on a device with two insulated-gate transistors, a charger-discharger, and a gate voltage correction circuit. The device allows for increased power handling capability and ensures equalized gate voltages during various operations.

The switching power supply circuit patent describes a circuit that generates an output voltage using an output stage circuit consisting of an output transistor and a synchronous rectification transistor. The circuit includes various components such as an error amplifier, a slope voltage generation circuit, a comparator, a clock signal generation circuit, and a control drive circuit.

The power factor correction circuit patent presents a control circuit for a power factor correction circuit that includes a DC-DC converter. The control circuit adjusts the gain of the amplifier and the gradient of the slope voltage based on the load power of the DC-DC converter.

The terahertz device patent describes a device that can generate and transmit electromagnetic waves in the terahertz band. The device includes a terahertz element and a waveguide, with the terahertz element positioned in the transmission region of the waveguide.

The nitride semiconductor device patent focuses on a device with specific layers and electrodes, including an electron transit layer, an electron supply layer, a gate layer, a gate electrode, an insulation layer, a source electrode, and a drain electrode.

The insulated die pad patent describes a semiconductor device with separate die pads for high-voltage and low-voltage components. A resistive element is mounted on the high-voltage die pad, and a semiconductor element is mounted on the low-voltage die pad.

The semiconductor device patent presents a device with a semiconductor chip that includes a first conductive layer, a second conductive layer, an insulating layer, and a first pad.

The final patent describes a semiconductor device with multiple semiconductor elements supported by a conductive support. A third semiconductor element is used to insulate the other elements, and the distance between the leads on the conductive support is determined based on insulation life, material constants, and voltage.

Notable applications:

  • Transmission circuit with variable resistance circuits controlled by a controller.
  • Semiconductor device with two insulated-gate transistors and a gate voltage correction circuit.
  • Switching power supply circuit with an output stage circuit and various control components.
  • Power factor correction circuit with a control circuit for a DC-DC converter.
  • Terahertz device for generating and transmitting electromagnetic waves.
  • Nitride semiconductor device with specific layers and electrodes.
  • Insulated die pad for separate mounting of high-voltage and low-voltage components.
  • Semiconductor device with a semiconductor chip and a first pad.
  • Semiconductor device with multiple semiconductor elements and a conductive support.



Patent applications for ROHM CO., LTD. on November 30th, 2023

TACTILE SENSE PRESENTATION DEVICE, TACTILE SENSE PRESENTATION METHOD, RECORDING MEDIUM, AND ELECTRONIC DEVICE (18322050)

Main Inventor

Takashi NAIKI


MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD (18448600)

Main Inventor

Martin Wilfried HELLER


AUTONOMOUS MOVEMENT DEVICE AND AUTONOMOUS MOVEMENT SYSTEM (18447961)

Main Inventor

Hiroshi YAGUMA


SEMICONDUCTOR DEVICE (18196436)

Main Inventor

Kengo OHMORI


SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE DESIGN METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD (18449360)

Main Inventor

Yoshizo OSUMI


SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE (18029105)

Main Inventor

Bungo TANAKA


SEMICONDUCTOR DEVICE (18447832)

Main Inventor

Masahiko ARIMURA


NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE (18364479)

Main Inventor

Kentaro CHIKAMATSU


TERAHERTZ DEVICE (17766927)

Main Inventor

Jaeyoung KIM


CONTROL CIRCUIT, POWER FACTOR CORRECTION CIRCUIT, AND ELECTRIC APPLIANCE (18315992)

Main Inventor

Manae ITO


SWITCHING POWER SUPPLY CIRCUIT AND SWITCHING POWER SUPPLY DEVICE (18302982)

Main Inventor

Tadashi AKAHO


SEMICONDUCTOR DEVICE (18448285)

Main Inventor

Naoki TAKAHASHI


TRANSMISSION CIRCUIT, ELECTRONIC CONTROL UNIT, AND VEHICLE (18449780)

Main Inventor

Toru MUKAI