RESONAC CORPORATION patent applications published on March 21st, 2024
Contents
- 1 Patent applications for RESONAC CORPORATION on March 21st, 2024
- 1.1 RESIN MOLDED PRODUCT (18274347)
- 1.2 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITION FOR TEMPORARY FIXATION MATERIAL, FILM FOR TEMPORARY FIXATION MATERIAL, AND LAMINATED FILM FOR TEMPORARY FIXATION MATERIAL (18381288)
- 1.3 SIC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SIC EPITAXIAL WAFER (18367753)
- 1.4 SiC EPITAXIAL WAFER (18523840)
- 1.5 PROGRAM, PROPOSAL DEVICE, AND PROPOSAL METHOD (18264833)
- 1.6 COOLING STRUCTURE (18263034)
Patent applications for RESONAC CORPORATION on March 21st, 2024
RESIN MOLDED PRODUCT (18274347)
Main Inventor
Hirofumi SHIOKAWA
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITION FOR TEMPORARY FIXATION MATERIAL, FILM FOR TEMPORARY FIXATION MATERIAL, AND LAMINATED FILM FOR TEMPORARY FIXATION MATERIAL (18381288)
Main Inventor
Emi MIYAZAWA
SIC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SIC EPITAXIAL WAFER (18367753)
Main Inventor
Kensho TANAKA
SiC EPITAXIAL WAFER (18523840)
Main Inventor
Hiromasa SUO
PROGRAM, PROPOSAL DEVICE, AND PROPOSAL METHOD (18264833)
Main Inventor
Shunsuke KURAHASHI
COOLING STRUCTURE (18263034)
Main Inventor
Yuji FUKUKAWA
