RESONAC CORPORATION patent applications published on March 21st, 2024
Summary of the patent applications from RESONAC CORPORATION on March 21st, 2024
RESONAC CORPORATION has recently filed patents for innovative technologies in the field of semiconductor materials, specifically focusing on SiC epitaxial wafers. These patents aim to improve the quality, performance, and reliability of SiC-based devices by addressing issues such as warping, heat dissipation, and carrier concentration uniformity. The company's recent innovations include cooling structures with enhanced refrigerant cooling efficiency, heating element configurations for optimized heat dissipation, and SiC epitaxial wafers with improved carrier concentration uniformity.
Notable applications of these technologies include:
- Air conditioning systems
- Power electronics
- High-temperature applications
- Semiconductor manufacturing
- Automotive cooling systems
- Industrial refrigeration units
These innovations offer benefits such as increased cooling capacity, improved device performance, enhanced reliability, and energy efficiency. The potential commercial applications span across various industries including electronics, automotive, aerospace, and semiconductor manufacturing. By addressing key challenges in semiconductor materials and thermal management, RESONAC CORPORATION's patents pave the way for more efficient and reliable electronic devices in the market.
Contents
- 1 Patent applications for RESONAC CORPORATION on March 21st, 2024
- 1.1 RESIN MOLDED PRODUCT (18274347)
- 1.2 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITION FOR TEMPORARY FIXATION MATERIAL, FILM FOR TEMPORARY FIXATION MATERIAL, AND LAMINATED FILM FOR TEMPORARY FIXATION MATERIAL (18381288)
- 1.3 SIC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SIC EPITAXIAL WAFER (18367753)
- 1.4 SiC EPITAXIAL WAFER (18523840)
- 1.5 PROGRAM, PROPOSAL DEVICE, AND PROPOSAL METHOD (18264833)
- 1.6 COOLING STRUCTURE (18263034)
Patent applications for RESONAC CORPORATION on March 21st, 2024
RESIN MOLDED PRODUCT (18274347)
Main Inventor
Hirofumi SHIOKAWA
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITION FOR TEMPORARY FIXATION MATERIAL, FILM FOR TEMPORARY FIXATION MATERIAL, AND LAMINATED FILM FOR TEMPORARY FIXATION MATERIAL (18381288)
Main Inventor
Emi MIYAZAWA
SIC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SIC EPITAXIAL WAFER (18367753)
Main Inventor
Kensho TANAKA
SiC EPITAXIAL WAFER (18523840)
Main Inventor
Hiromasa SUO
PROGRAM, PROPOSAL DEVICE, AND PROPOSAL METHOD (18264833)
Main Inventor
Shunsuke KURAHASHI
COOLING STRUCTURE (18263034)
Main Inventor
Yuji FUKUKAWA
