Qualcomm incorporated (20240114497). THERMAL MITIGATION IN USER EQUIPMENT HAVING MULTIPLE COMMUNICATION MODULES simplified abstract
Contents
- 1 THERMAL MITIGATION IN USER EQUIPMENT HAVING MULTIPLE COMMUNICATION MODULES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 THERMAL MITIGATION IN USER EQUIPMENT HAVING MULTIPLE COMMUNICATION MODULES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
THERMAL MITIGATION IN USER EQUIPMENT HAVING MULTIPLE COMMUNICATION MODULES
Organization Name
Inventor(s)
Mahbod Ghelichi of San Diego CA (US)
James Francis Geekie of Carlsbad CA (US)
Raghu Narayan Challa of San Diego CA (US)
Mihir Vijay Laghate of San Diego CA (US)
THERMAL MITIGATION IN USER EQUIPMENT HAVING MULTIPLE COMMUNICATION MODULES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240114497 titled 'THERMAL MITIGATION IN USER EQUIPMENT HAVING MULTIPLE COMMUNICATION MODULES
Simplified Explanation
The present disclosure provides methods, apparatuses, and systems for efficient thermal mitigation while maintaining wireless device performance on a primary component carrier (PCC). Embodiments described may include implementation of target transceiver module configurations, where bandwidth (e.g., PCC bands and secondary component carrier (SCC) bands) may be monitored by a wireless device based on intra-module target configurations and/or inter-module target configurations. In scenarios where operating temperatures exceed temperature thresholds, target transceiver module configurations may be implemented to transition PCC bands, SCC bands, or both, from a PCC-resident transceiver module to another transceiver module to reduce the operating temperatures of concern.
- Methods, apparatuses, and systems for efficient thermal mitigation in wireless devices
- Implementation of target transceiver module configurations to monitor bandwidth and transition bands between modules
- Monitoring of PCC bands and SCC bands based on intra-module and inter-module target configurations
- Transitioning bands between modules to reduce operating temperatures when thresholds are exceeded
Potential Applications
The technology described in the patent application could be applied in various wireless devices such as smartphones, tablets, and IoT devices to improve thermal management and maintain performance under high temperature conditions.
Problems Solved
This technology addresses the issue of thermal management in wireless devices, ensuring that performance is maintained even when operating temperatures exceed safe thresholds.
Benefits
The benefits of this technology include improved device reliability, extended lifespan, and enhanced performance under challenging thermal conditions.
Potential Commercial Applications
Potential commercial applications of this technology include mobile device manufacturing, IoT device production, and any other industries where thermal management is critical for device performance.
Possible Prior Art
One possible prior art could be the use of thermal throttling techniques in mobile devices to manage heat dissipation and prevent overheating issues.
Unanswered Questions
How does this technology impact battery life in wireless devices?
The article does not address the potential impact of thermal mitigation techniques on battery life in wireless devices.
Are there any specific limitations to the bandwidth monitoring capabilities of the target transceiver module configurations?
The article does not provide information on any limitations or constraints related to the bandwidth monitoring capabilities of the target transceiver module configurations.
Original Abstract Submitted
in some aspects, the present disclosure provides methods, apparatuses, and systems for efficient thermal mitigation while maintaining wireless device performance on a primary component carrier (pcc). embodiments described may include implementation of target transceiver module configurations, where bandwidth (e.g., pcc bands and secondary component carrier (scc) bands) may be monitored by a wireless device based on intra-module target configurations and/or inter-module target configurations. an intra-module target configuration may include a target transceiver module monitoring both pcc bands and scc bands. an inter-module target configuration may include or refer to a plurality of target transceiver modules together monitoring pcc bands and scc bands. in scenarios where operating temperatures exceed temperature thresholds, target transceiver module configurations may be implemented to transition pcc bands, scc bands, or both, from a pcc-resident transceiver module to another transceiver module to reduce the operating temperatures of concern. various additional and alternative aspects are described herein.
