Qualcomm incorporated (20240097648). PACKAGE COMPRISING AN ACOUSTIC DEVICE AND A POLYMER CAP LAYER simplified abstract

PACKAGE COMPRISING AN ACOUSTIC DEVICE AND A POLYMER CAP LAYER

Organization Name

qualcomm incorporated

Inventor(s)

Sebastian Brunner of Graz (AT)

Changhan Hobie Yun of San Diego CA (US)

Stefan Leopold Hatzl of Kloech (AT)

Manuel Hofer of Graz (AT)

Horst Droescher of Frauental an der Laßnitz (AT)

Christian Hoffmann of BAD FEILNBACH (DE)

PACKAGE COMPRISING AN ACOUSTIC DEVICE AND A POLYMER CAP LAYER - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240097648 titled 'PACKAGE COMPRISING AN ACOUSTIC DEVICE AND A POLYMER CAP LAYER

Simplified Explanation

The patent application describes a package comprising an acoustic device, a polymer frame, a polymer cap layer, and a cavity located between the acoustic device and the polymer cap layer.

• The package includes an acoustic device with an acoustic element coupled to a substrate.
• The polymer frame is coupled to the acoustic device and contains a plurality of frame interconnects.
• The polymer cap layer is coupled to the acoustic device through the polymer frame and includes a plurality of cap interconnects.
• A cavity is located between the acoustic device and the polymer cap layer.

Potential Applications

The technology described in the patent application could be used in:

• Audio devices
• Noise-canceling headphones
• Hearing aids

Problems Solved

This technology helps in:

• Protecting the acoustic device from external elements
• Enhancing the performance of the acoustic device
• Improving the durability of the acoustic device

Benefits

The benefits of this technology include:

• Increased protection for the acoustic device
• Improved sound quality
• Longer lifespan of the acoustic device

Potential Commercial Applications

The technology could be commercially applied in:

• Consumer electronics industry
• Healthcare industry
• Entertainment industry

Possible Prior Art

One possible prior art could be the use of polymer frames and cap layers in electronic devices to protect sensitive components.

How does this technology compare to existing acoustic device packaging solutions in terms of cost-effectiveness?

The cost-effectiveness of this technology compared to existing solutions is not addressed in the patent application. It would be interesting to know if the added features and benefits of this packaging justify any potential increase in cost.

What materials are used in the construction of the polymer frame and cap layer, and how do they impact the overall performance of the acoustic device?

The specific materials used in the polymer frame and cap layer are not detailed in the patent application. Understanding the materials and their properties could provide insights into the performance and durability of the acoustic device.

Original Abstract Submitted

a package comprising an acoustic device, a polymer frame coupled to the acoustic device, a plurality of frame interconnects located in the polymer frame, where the plurality of frame interconnects are coupled to the acoustic device, a polymer cap layer coupled to the acoustic device though the polymer frame, where the polymer cap layer is configured as a cap for the acoustic device, a plurality of cap interconnects located in the polymer cap layer, where the plurality of cap interconnects are coupled to the plurality of frame interconnects, and a cavity located between the acoustic device and the polymer cap layer. the acoustic device includes a substrate and an acoustic element coupled to the substrate.