Qualcomm incorporated (20240096790). PORT LANDING-FREE LOW-SKEW SIGNAL DISTRIBUTION WITH BACKSIDE METALLIZATION AND BURIED RAIL simplified abstract
Contents
- 1 PORT LANDING-FREE LOW-SKEW SIGNAL DISTRIBUTION WITH BACKSIDE METALLIZATION AND BURIED RAIL
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PORT LANDING-FREE LOW-SKEW SIGNAL DISTRIBUTION WITH BACKSIDE METALLIZATION AND BURIED RAIL - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PORT LANDING-FREE LOW-SKEW SIGNAL DISTRIBUTION WITH BACKSIDE METALLIZATION AND BURIED RAIL
Organization Name
Inventor(s)
Mustafa Badaroglu of Leuven (BE)
Zhongze Wang of San Diego CA (US)
PORT LANDING-FREE LOW-SKEW SIGNAL DISTRIBUTION WITH BACKSIDE METALLIZATION AND BURIED RAIL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096790 titled 'PORT LANDING-FREE LOW-SKEW SIGNAL DISTRIBUTION WITH BACKSIDE METALLIZATION AND BURIED RAIL
Simplified Explanation
The integrated circuit structures described in the patent application feature buried rails and backside metals for routing input signals to and/or output signals from cells within the structures. This design enables port landing-free connections to input and output ports, enhancing signal routing flexibility.
- Buried rails and backside metals are used for routing input and output signals within integrated circuit structures.
- Port landing-free connections to input and output ports are enabled, improving signal routing flexibility.
Potential Applications
The technology described in this patent application could be applied in various fields such as telecommunications, data processing, and consumer electronics where efficient signal routing is crucial.
Problems Solved
This technology solves the problem of limited signal routing flexibility within integrated circuit structures, allowing for more efficient and versatile connections between cells.
Benefits
The use of buried rails and backside metals in these integrated circuit structures enhances signal routing flexibility, leading to improved performance and functionality of the circuits.
Potential Commercial Applications
With its ability to enable port landing-free connections and enhance signal routing flexibility, this technology could find applications in industries such as semiconductor manufacturing, telecommunications equipment, and computer hardware.
Possible Prior Art
One possible prior art for this technology could be the use of traditional routing methods within integrated circuit structures, which may not offer the same level of flexibility and efficiency as the buried rails and backside metals described in this patent application.
Unanswered Questions
How does this technology compare to existing signal routing methods in terms of efficiency and performance?
This article does not provide a direct comparison between this technology and existing signal routing methods, leaving the reader to wonder about the relative advantages and disadvantages of each approach.
What are the potential challenges or limitations of implementing this technology in practical applications?
The article does not address any potential challenges or limitations that may arise when implementing this technology in real-world scenarios, leaving room for speculation on the feasibility and practicality of the innovation.
Original Abstract Submitted
disclosed are integrated circuit structures with buried rails and backside metals for routing input signals to and/or output signals from one or more cells of the integrated circuit structures. port landing-free connections to input ports and/or from output ports are enabled. as a result, signal routing flexibility is enhanced.
