Qualcomm incorporated (20240096750). SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION simplified abstract
Contents
- 1 SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION
Organization Name
Inventor(s)
Qingqing Liang of San Diego CA (US)
Periannan Chidambaram of San Diego CA (US)
George Pete Imthurn of San Diego CA (US)
Stanley Seungchul Song of San Diego CA (US)
SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096750 titled 'SELF-ALIGNED BACKSIDE CONTACT MODULE FOR 3DIC APPLICATION
Simplified Explanation
The patent application describes integrated circuit structures with through-substrate vias (TSVs) processed through self-aligned contact modules, resulting in smaller and denser TSVs with low mechanical stress. The denser TSVs allow for more flexible wiring options.
- Through-substrate vias (TSVs) are formed using self-aligned contact modules.
- Smaller and denser TSVs are achieved with low mechanical stress.
- Denser TSVs enable more flexible wiring options.
Potential Applications
The technology could be applied in:
- High-performance computing
- Telecommunications
- Automotive electronics
Problems Solved
The technology addresses:
- Limitations in wiring options due to TSV size and density
- Mechanical stress issues in TSV formation
Benefits
The benefits of this technology include:
- Improved circuit performance
- Enhanced flexibility in wiring configurations
- Reduced mechanical stress on the integrated circuit
Potential Commercial Applications
The technology could be utilized in:
- Semiconductor manufacturing
- Electronic device production
- Aerospace industry applications
Possible Prior Art
One possible prior art could be the use of traditional TSV processing methods with larger vias and higher mechanical stress.
Unanswered Questions
How does this technology compare to existing TSV processing methods in terms of cost-effectiveness?
The article does not provide information on the cost-effectiveness of this technology compared to traditional TSV processing methods.
What impact does the use of self-aligned contact modules have on the overall performance of the integrated circuits?
The article does not discuss the specific impact of self-aligned contact modules on the performance of the integrated circuits.
Original Abstract Submitted
disclosed are integrated circuit structures with through-substrate vias (tsvs) processed through self-aligned contact modules. as a result, much smaller and/or denser tsvs are formed with low mechanical stress. the denser tsvs allow for more flexible wiring options.
