PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME: abstract simplified (18328913)

• This abstract for appeared for patent application number 18328913 Titled 'PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME'

Simplified Explanation

The abstract describes a package structure that consists of several components. Firstly, there is a semiconductor die that is bonded to a redistribution structure using first bonding elements. Secondly, there is a wall structure that is also bonded to the redistribution structure using second bonding elements. The wall structure is made up of multiple partitions arranged in a ring shape, but with gaps in between. The semiconductor die is positioned within this ring. Lastly, there is a substrate that is bonded to the other side of the redistribution structure using third bonding elements. The substrate is also electrically connected to the semiconductor die.

Original Abstract Submitted

A package structure is provided. The package structure includes a semiconductor die bonding on a first surface of a redistribution structure through first bonding elements, and a wall structure bonding on the first surface of the redistribution structure through second bonding elements. The wall structure includes a plurality of partitions laterally arranged in a discontinuous ring, and the semiconductor die is located within the discontinuous ring. The package structure also includes a substrate on a second surface of the redistribution structure through third bonding elements and in electrical connection with the semiconductor die