Nec corporation (20240136274). QUANTUM DEVICE simplified abstract
Contents
- 1 QUANTUM DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 QUANTUM DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
QUANTUM DEVICE
Organization Name
Inventor(s)
QUANTUM DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136274 titled 'QUANTUM DEVICE
Simplified Explanation
The abstract describes a quantum device designed to effectively cool a quantum chip and the surrounding area. The device includes a quantum chip located on an interposer, which consists of an interposer substrate and an interposer wiring layer. The interposer wiring layer contains a superconducting material layer and a non-superconducting material layer.
- Quantum device for cooling quantum chip and surrounding area:
- Includes quantum chip and interposer - Interposer has substrate and wiring layer - Wiring layer contains superconducting and non-superconducting material
Potential Applications
The technology could be applied in: - Quantum computing - High-performance computing - Superconducting electronics
Problems Solved
This technology addresses the issue of cooling quantum chips, which is crucial for their proper functioning and performance.
Benefits
- Improved efficiency of quantum chips - Enhanced reliability of quantum devices - Increased processing power for quantum applications
Potential Commercial Applications
Optimized for SEO: "Commercial Applications of Quantum Cooling Device" - Data centers - Aerospace industry - Medical imaging technology
Possible Prior Art
There may be prior art related to superconducting cooling systems for electronic devices, but specific examples are not provided in the abstract.
Unanswered Questions
How does the cooling system impact the overall performance of the quantum chip?
The abstract does not delve into the specific effects of the cooling system on the quantum chip's performance.
Are there any limitations to the cooling capabilities of this quantum device?
The abstract does not mention any potential limitations or constraints of the cooling system.
Original Abstract Submitted
a quantum device capable of effectively cooling a quantum chip and an area (e.g., a space) therearound is provided. a quantum device includes a quantum chip and an interposer on which the quantum chip is located. the interposer includes an interposer substrate and an interposer wiring layer. the interposer wiring layer is disposed on a surface of the interposer substrate on a side on which the quantum chip is located. the interposer wiring layer includes, in at least a part thereof, a superconducting material layer formed of a superconducting material and a non-superconducting material layer formed of a non-superconducting material.
