NEXPERIA B.V. patent applications published on March 21st, 2024

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Patent applications for NEXPERIA B.V. on March 21st, 2024

REDUCED STRESS CLIP FOR SEMICONDUCTOR DIE (18467786)

Main Inventor

Homer Gler Malveda


METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS A SEMICONDUCTOR PACKAGE ASSEMBLY OBTAINED WITH THIS METHOD (18467779)

Main Inventor

Haibo Fan


SEMICONDUCTOR POWER DEVICE WITH IMPROVED RUGGEDNESS (18467293)

Main Inventor

Georgio El Zammar


MPS DIODE HAVING A NON-UNIFORMLY DOPED REGION AND METHOD FOR MANUFACTURING THE SAME (18467232)

Main Inventor

Massimo Cataldo Mazzillo


MPS DIODE HAVING A DOPED REGION AND METHOD FOR MANUFACTURING THE SAME (18467251)

Main Inventor

Massimo Cataldo Mazzillo


MPS DIODE HAVING NON-UNIFORMLY SPACED WELLS AND METHOD FOR MANUFACTURING THE SAME (18467258)

Main Inventor

Massimo Cataldo Mazzillo


MPS DIODE HAVING NON-UNIFORMLY SPACED WELLS AND METHOD FOR MANUFACTURING THE SAME (18467278)

Main Inventor

Massimo Cataldo Mazzillo


COOLING STAGE FOR COOLING DOWN A HEATED CARRIER (18467245)

Main Inventor

Arne de Roest

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