NEXPERIA B.V. patent applications published on March 21st, 2024
Summary of the patent applications from NEXPERIA B.V. on March 21st, 2024
NEXPERIA B.V. has recently filed patents related to cooling stages for heated carriers with mounted components and MPS diodes with specific design features. The cooling stage utilizes supporting members to separate the carrier from a cooling body, allowing for efficient cooling through thermal convection. Different types of carriers can be accommodated by using different supporting members or adjusting the temperature of the cooling body. On the other hand, the MPS diode features a semiconductor body with an active area containing a drift region and wells of different conductivity types, along with a metal layer assembly for Schottky and Ohmic contacts. The diode's design includes increasing spacing between wells in an outward direction to improve performance characteristics.
- Notable Applications:**
- Cooling stages for electronics manufacturing, automotive assembly, and medical device production.
- MPS diodes in power electronics, high-frequency applications, and solar panels.
Contents
- 1 Patent applications for NEXPERIA B.V. on March 21st, 2024
- 1.1 REDUCED STRESS CLIP FOR SEMICONDUCTOR DIE (18467786)
- 1.2 METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS A SEMICONDUCTOR PACKAGE ASSEMBLY OBTAINED WITH THIS METHOD (18467779)
- 1.3 SEMICONDUCTOR POWER DEVICE WITH IMPROVED RUGGEDNESS (18467293)
- 1.4 MPS DIODE HAVING A NON-UNIFORMLY DOPED REGION AND METHOD FOR MANUFACTURING THE SAME (18467232)
- 1.5 MPS DIODE HAVING A DOPED REGION AND METHOD FOR MANUFACTURING THE SAME (18467251)
- 1.6 MPS DIODE HAVING NON-UNIFORMLY SPACED WELLS AND METHOD FOR MANUFACTURING THE SAME (18467258)
- 1.7 MPS DIODE HAVING NON-UNIFORMLY SPACED WELLS AND METHOD FOR MANUFACTURING THE SAME (18467278)
- 1.8 COOLING STAGE FOR COOLING DOWN A HEATED CARRIER (18467245)
Patent applications for NEXPERIA B.V. on March 21st, 2024
REDUCED STRESS CLIP FOR SEMICONDUCTOR DIE (18467786)
Main Inventor
Homer Gler Malveda
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS A SEMICONDUCTOR PACKAGE ASSEMBLY OBTAINED WITH THIS METHOD (18467779)
Main Inventor
Haibo Fan
SEMICONDUCTOR POWER DEVICE WITH IMPROVED RUGGEDNESS (18467293)
Main Inventor
Georgio El Zammar
MPS DIODE HAVING A NON-UNIFORMLY DOPED REGION AND METHOD FOR MANUFACTURING THE SAME (18467232)
Main Inventor
Massimo Cataldo Mazzillo
MPS DIODE HAVING A DOPED REGION AND METHOD FOR MANUFACTURING THE SAME (18467251)
Main Inventor
Massimo Cataldo Mazzillo
MPS DIODE HAVING NON-UNIFORMLY SPACED WELLS AND METHOD FOR MANUFACTURING THE SAME (18467258)
Main Inventor
Massimo Cataldo Mazzillo
MPS DIODE HAVING NON-UNIFORMLY SPACED WELLS AND METHOD FOR MANUFACTURING THE SAME (18467278)
Main Inventor
Massimo Cataldo Mazzillo
COOLING STAGE FOR COOLING DOWN A HEATED CARRIER (18467245)
Main Inventor
Arne de Roest
