Micron technology, inc. (20240128158). TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME simplified abstract
Contents
- 1 TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME
Organization Name
Inventor(s)
YUTAKA Nakae of Hiroshima (JP)
NOBUYUKI Nakamura of Hiroshima (JP)
TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128158 titled 'TSV-BUMP STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE SAME
Simplified Explanation
The abstract describes a through-silicon via (TSV)-bump structure, which includes a TSV in a semiconductor substrate and a bump on the TSV. The bump consists of a conductive plug portion and a step structure portion under the conductive plug portion, designed to electrically couple the TSV and the conductive plug portion.
- TSV-bump structure:
* TSV in semiconductor substrate * Bump on TSV * Bump includes conductive plug portion and step structure portion * Step structure electrically couples TSV and conductive plug portion
Potential Applications
The TSV-bump structure can be used in:
- Advanced semiconductor packaging
- High-performance computing systems
- 3D integrated circuits
Problems Solved
The TSV-bump structure addresses:
- Improving electrical connections in semiconductor devices
- Enhancing signal transmission efficiency
- Reducing signal interference
Benefits
The TSV-bump structure offers:
- Increased data transfer speeds
- Enhanced reliability of semiconductor devices
- Compact design for space-saving applications
Potential Commercial Applications
The TSV-bump structure can be applied in:
- Telecommunications equipment
- Automotive electronics
- Consumer electronics
Possible Prior Art
One possible prior art could be the use of traditional wire bonding techniques in semiconductor packaging. Another could be the use of flip-chip technology for interconnecting semiconductor devices.
Unanswered Questions
How does the TSV-bump structure impact power consumption in semiconductor devices?
The article does not provide information on the power efficiency of the TSV-bump structure compared to traditional interconnection methods.
What are the potential challenges in manufacturing the TSV-bump structure at scale?
The article does not discuss the scalability and manufacturing challenges that may arise when implementing the TSV-bump structure in mass production.
Original Abstract Submitted
according to one or more embodiments of the disclosure, a through-silicon via (tsv)-bump structure is provide. the tsv-bump structure comprises a tsv in a semiconductor substrate and a bump on the tsv. the bump includes a conductive plug portion and a step structure portion under the conductive plug portion. the step structure is configured to electrically couple the tsv and the conductive plug portion with each other.
