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| − | '''Summary of the patent applications from Micron Technology, Inc. on November 30th, 2023'''
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| − | Micron Technology, Inc. has recently filed several patents related to microelectronic devices, memory arrays, and key management systems. These patents aim to improve memory cell functionality, organization, and manufacturing processes.
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| − | Summary:
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| − | Micron Technology, Inc. has filed patents for microelectronic devices consisting of source and stack structures, with slits and memory cell pillars extending through them. They have also filed patents for memory arrays formed using stacks of insulative and conductive tiers, with channel-material strings and conductive vias. Another patent describes memory arrays with memory blocks organized into vertical stacks of insulative and conductive tiers, including different compositions of insulative tiers. Additionally, Micron has filed patents for memory arrays formed using alternating tiers of different materials, with sacrificial plugs and upper channel-material strings. They have also filed patents for electronic devices with stack structures made of dielectric and conductive materials, and for microelectronic devices with vertically stacked memory cells and control logic devices. Furthermore, Micron has filed patents for interfaces between memory modules and circuit boards, and for securely updating semiconductor devices using a key management system. Lastly, they have filed a patent for manufacturing textured optoelectronic devices using conductive transparent texturing materials.
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| − | Bullet Points:
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| − | * Micron Technology, Inc. has filed patents for microelectronic devices, memory arrays, and key management systems.
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| − | * The patents aim to improve memory cell functionality, organization, and manufacturing processes.
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| − | * They include devices with source and stack structures, slits, and memory cell pillars.
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| − | * Memory arrays are formed using insulative and conductive tiers, with channel-material strings and conductive vias.
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| − | * Different compositions of insulative tiers and sacrificial plugs are also utilized.
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| − | * Electronic devices have stack structures made of dielectric and conductive materials.
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| − | * Interfaces between memory modules and circuit boards are also covered.
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| − | * Securely updating semiconductor devices is achieved through a key management system.
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| − | * Textured optoelectronic devices are manufactured using conductive transparent texturing materials.
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| − | Notable Applications:
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| − | * Microelectronic devices with improved memory cell functionality and organization.
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| − | * Memory arrays formed using insulative and conductive tiers, with channel-material strings and conductive vias.
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| − | * Memory arrays with memory blocks organized into vertical stacks of insulative and conductive tiers.
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| − | * Electronic devices with stack structures made of dielectric and conductive materials.
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| − | * Interfaces between memory modules and circuit boards.
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| − | * Securely updating semiconductor devices using a key management system.
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| − | * Manufacturing textured optoelectronic devices using conductive transparent texturing materials.
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| | ==Patent applications for micron technology, on November 30th, 2023== | | ==Patent applications for micron technology, on November 30th, 2023== |
