Micron Technology, Inc. patent applications published on November 30th, 2023

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Summary of the patent applications from Micron Technology, Inc. on November 30th, 2023

Micron Technology, Inc. has recently filed several patents related to microelectronic devices, memory arrays, and key management systems. These patents aim to improve memory cell functionality, organization, and manufacturing processes.

Summary: Micron Technology, Inc. has filed patents for microelectronic devices consisting of source and stack structures, with slits and memory cell pillars extending through them. They have also filed patents for memory arrays formed using stacks of insulative and conductive tiers, with channel-material strings and conductive vias. Another patent describes memory arrays with memory blocks organized into vertical stacks of insulative and conductive tiers, including different compositions of insulative tiers. Additionally, Micron has filed patents for memory arrays formed using alternating tiers of different materials, with sacrificial plugs and upper channel-material strings. They have also filed patents for electronic devices with stack structures made of dielectric and conductive materials, and for microelectronic devices with vertically stacked memory cells and control logic devices. Furthermore, Micron has filed patents for interfaces between memory modules and circuit boards, and for securely updating semiconductor devices using a key management system. Lastly, they have filed a patent for manufacturing textured optoelectronic devices using conductive transparent texturing materials.

Bullet Points:

  • Micron Technology, Inc. has filed patents for microelectronic devices, memory arrays, and key management systems.
  • The patents aim to improve memory cell functionality, organization, and manufacturing processes.
  • They include devices with source and stack structures, slits, and memory cell pillars.
  • Memory arrays are formed using insulative and conductive tiers, with channel-material strings and conductive vias.
  • Different compositions of insulative tiers and sacrificial plugs are also utilized.
  • Electronic devices have stack structures made of dielectric and conductive materials.
  • Interfaces between memory modules and circuit boards are also covered.
  • Securely updating semiconductor devices is achieved through a key management system.
  • Textured optoelectronic devices are manufactured using conductive transparent texturing materials.

Notable Applications:

  • Microelectronic devices with improved memory cell functionality and organization.
  • Memory arrays formed using insulative and conductive tiers, with channel-material strings and conductive vias.
  • Memory arrays with memory blocks organized into vertical stacks of insulative and conductive tiers.
  • Electronic devices with stack structures made of dielectric and conductive materials.
  • Interfaces between memory modules and circuit boards.
  • Securely updating semiconductor devices using a key management system.
  • Manufacturing textured optoelectronic devices using conductive transparent texturing materials.



Contents

Patent applications for Micron Technology, Inc. on November 30th, 2023

VOLTAGE TRACKING CIRCUIT (17824479)

Main Inventor

Leon Zlotnik


LIFESPAN FORECASTING OF MEMORY DEVICES AND PREDICTIVE DEVICE HEALTH MANAGEMENT (17824749)

Main Inventor

Manjunath Chandrashekaraiah


CRYPTOGRAPHIC BLOCK LOCKING IN A NON-VOLATILE MEMORY DEVICE (17804153)

Main Inventor

Jeremy BINFET


TECHNIQUES FOR DETECTION OF SHUTDOWN PATTERNS (17752354)

Main Inventor

Roberto Izzi


SELECTIVE SINGLE-LEVEL MEMORY CELL OPERATION (17824725)

Main Inventor

Donghua Zhou


CAPTURING VIDEO DATA OF EVENTS ASSOCIATED WITH VEHICLES (17806888)

Main Inventor

Alyssa SCARBROUGH


Data Recorders of Autonomous Vehicles (18326972)

Main Inventor

Gil Golov


BLACK BOX DATA RECORDER FOR AUTONOMOUS DRIVING VEHICLE (18326984)

Main Inventor

Gil Golov


DRIVE STRENGTH CALIBRATION FOR MULTI-LEVEL SIGNALING (18202584)

Main Inventor

Peter Mayer


APPARATUSES AND METHODS FOR COMMAND DECODING (17752573)

Main Inventor

YUTAKA UEMURA


APPARATUSES AND METHODS FOR COMMAND DECODING (17752605)

Main Inventor

YUTAKA UEMURA


MEMORY DEVICES FOR MULTIPLE READ OPERATIONS (18232949)

Main Inventor

Eric N. Lee


PMOS THRESHOLD COMPENSATION SENSE AMPLIFIER FOR FeRAM DEVICES (17829046)

Main Inventor

Tong Liu


APPARATUSES AND METHODS FOR OPERATIONS IN A SELF-REFRESH STATE (18202659)

Main Inventor

Perry V. Lea


APPARATUSES AND METHODS FOR BIAS TEMPERATURE INSTABILITY MITIGATION (17825600)

Main Inventor

YOSHIYA KOMATSU


APPARATUSES AND METHODS FOR ARRANGING READ DATA FOR OUTPUT (17827582)

Main Inventor

Ryo Fujimaki


METHODS OF CONFIGURING A MEMORY (18232386)

Main Inventor

Pin-Chou Chiang


WORDLINE BOOST BY CHARGE SHARING IN A MEMORY DEVICE (17752785)

Main Inventor

Mattia Robustelli


Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells (17752207)

Main Inventor

Haoyu Li


PARTIAL BLOCK HANDLING PROTOCOL IN A NON-VOLATILE MEMORY DEVICE (17825439)

Main Inventor

Zhongguang Xu


ADAPTIVE POROGRAMMING DELAY SCHEME IN A MEMORY SUB-SYSTEM (17752590)

Main Inventor

Yu-Chung Lien


MEDIA MANAGEMENT (17824384)

Main Inventor

Donghua Zhou


INTERPOSERS FOR MEMORY DEVICE TESTING AND CHARACTERIZATION, INCLUDING INTERPOSERS FOR TESTING AND CHARACTERIZING DECISION FEEDBACK EQUALIZATION CIRCUITRY OF DDR5 MEMORY DEVICES (18109830)

Main Inventor

Eric J. Stave


NANO THROUGH SUBSTRATE VIAS FOR SEMICONDUCTOR DEVICES AND RELATED SYSTEMS AND METHODS (17827006)

Main Inventor

Kunal R. Parekh


MEMORY DEVICE INCLUDING CONTACT STRUCTURES HAVING MULTI-LAYER DIELECTRIC LINER (17826776)

Main Inventor

Shuangqiang Luo


MICROELECTRONIC DEVICES, RELATED ELECTRONIC SYSTEMS, AND METHODS OF FORMING MICROELECTRONIC DEVICES (17804247)

Main Inventor

Fatma Arzum Simsek-Ege


MICROELECTRONIC DEVICES, RELATED ELECTRONIC SYSTEMS, AND METHODS OF FORMING MICROELECTRONIC DEVICES (17804251)

Main Inventor

Fatma Arzum Simsek-Ege


RADIATION HARDENED SEMICONDUCTOR DEVICES AND PACKAGING (17825695)

Main Inventor

Chong Leong Gan


MICROELECTRONIC DEVICES INCLUDING STACK STRUCTURES HAVING DOPED INTERFACIAL REGIONS, AND RELATED SYSTEMS AND METHODS (17804530)

Main Inventor

Everett A. McTeer


TRANSISTOR WITH GATE ATTACHED FIELD PLATE (17752610)

Main Inventor

Michael A. Smith


TEXTURED OPTOELECTRONIC DEVICES AND ASSOCIATED METHODS OF MANUFACTURE (18359795)

Main Inventor

Lifang Xu


CLOUD-BASED CREATION OF A CUSTOMER-SPECIFIC SYMMETRIC KEY ACTIVATION DATABASE (18448815)

Main Inventor

Lance W. Dover


INTERFACES FOR COUPLING A MEMORY MODULE TO A CIRCUIT BOARD, AND ASSOCIATED DEVICES, MODULES, AND SYSTEMS (17804789)

Main Inventor

Anthony D. Veches


MICROELECTRONIC DEVICES, RELATED ELECTRONIC SYSTEMS, AND METHODS OF FORMING MICROELECTRONIC DEVICES (17804234)

Main Inventor

Fatma Arzum Simsek-Ege


MICROELECTRONIC DEVICES, RELATED ELECTRONIC SYSTEMS, AND METHODS OF FORMING MICROELECTRONIC DEVICES (17804270)

Main Inventor

Fatma Arzum Simsek-Ege


ELECTRONIC DEVICES COMPRISING SEGMENTED HIGH-K DIELECTRIC MATERIALS AND STORAGE NODE MATERIALS, RELATED SYSTEMS, AND METHODS OF FORMING (17804752)

Main Inventor

Yifen Liu


Memory Circuitry And Method Used In Forming Memory Circuitry (17751978)

Main Inventor

Collin Howder


Memory Circuitry And Method Used In Forming Memory Circuitry (17869586)

Main Inventor

Jordan D. Greenlee


Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Cells, Methods Used In Forming Integrated Circuitry, And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells ([[US Patent Application 17879140. Integrated Circuitry, Memory Arrays Comprising Strings Of Memory Cells, Methods Used In Forming Integrated Circuitry, And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells simplified abstract (Micron Technology, Inc.)|17879140]])

Main Inventor

Adam Barton


METHODS OF FORMING MICROELECTRONIC DEVICES (18359792)

Main Inventor

Collin Howder