Meta platforms technologies, llc (20240120246). CORROSION REDUCTION AT LIQUID METAL/METAL INTERFACES BY SELECTIVE INTRINSIC ALLOYING simplified abstract

CORROSION REDUCTION AT LIQUID METAL/METAL INTERFACES BY SELECTIVE INTRINSIC ALLOYING

Organization Name

meta platforms technologies, llc

Inventor(s)

Omar Awartani of Redmond WA (US)

Zhen Zheng of Bellevue WA (US)

Marcos Antonio Santana Andrade, Jr. of Seattle WA (US)

Kristopher Erickson of Sammamish WA (US)

Alejandra Alvarez Albarran of Bellevue WA (US)

Allison Tuuri of Seattle WA (US)

CORROSION REDUCTION AT LIQUID METAL/METAL INTERFACES BY SELECTIVE INTRINSIC ALLOYING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240120246 titled 'CORROSION REDUCTION AT LIQUID METAL/METAL INTERFACES BY SELECTIVE INTRINSIC ALLOYING

Simplified Explanation

The electronic device described in the patent application includes a circuit with multiple electrically-conductive components, including first, second, and third components. The third component is made of a gallium-based alloy and a metallic filler to reduce reactivity with the first and second components, minimizing deterioration over time.

• The third electrically-conductive component in the circuit is made of a gallium-based alloy and a metallic filler to reduce reactivity with the first and second components.
• The metallic filler in the third component helps minimize deterioration of the first and second electrically-conductive components over time.

Potential Applications

The technology described in the patent application could be applied in electronic devices, such as smartphones, tablets, and computers, to improve the longevity and reliability of the circuits.

Problems Solved

This technology addresses the issue of deterioration of electrically-conductive components over time due to reactivity with other materials in the circuit, ensuring the long-term functionality of electronic devices.

Benefits

The use of a gallium-based alloy and metallic filler in the third electrically-conductive component helps extend the lifespan of electronic devices by reducing deterioration of the circuit components.

Potential Commercial Applications

The technology could be valuable for manufacturers of electronic devices looking to enhance the durability and reliability of their products. A potential SEO-optimized title for this section could be "Commercial Applications of Gallium-Based Alloy Technology in Electronic Devices."

Possible Prior Art

One possible prior art could be the use of protective coatings on electrically-conductive components to prevent reactivity and deterioration over time.

How does the metallic filler specifically reduce reactivity with the first metal at the interfaces?

The metallic filler in the third electrically-conductive component acts as a barrier between the gallium-based alloy and the first metal, reducing direct contact and minimizing reactivity.

What are the specific electronic devices that could benefit most from this technology?

Electronic devices with high usage and complex circuits, such as smartphones and computers, could benefit the most from the improved longevity and reliability provided by this technology.

Original Abstract Submitted

an electronic device includes a substrate and a circuit having a plurality of electrically-conductive components disposed on the substrate. the plurality of electrically-conductive components includes first, second and third electrically-conductive components. the third electrically-conductive component has a first end portion forming a first interface with the first electrically-conductive component and a second end portion forming a second interface with the second electrically conductive component. the first electrically-conductive component is made of a first material including a first metal. the second electrically-conductive component is made of a second material including the first metal. the third electrically-conductive component is made of a third material including a gallium-based alloy and a metallic filler. the metallic filler reduces a reactivity of the third electrically-conductive component with the first metal at the first and second interfaces, and thus minimizes deterioration of the first electrically-conductive component and the second electrically-conductive component over time.