MULTI-DEVICE-CHASSIS/DEVICE MOVABLE COUPLING LIQUID COOLING SYSTEM: abstract simplified (17715235)

• This abstract for appeared for patent application number 17715235 Titled 'MULTI-DEVICE-CHASSIS/DEVICE MOVABLE COUPLING LIQUID COOLING SYSTEM'

Simplified Explanation

The abstract describes a liquid cooling system for a computing device. It consists of a multi-device chassis, a computing device, and a movable coupling system that connects the computing device to the chassis. The system includes a mounting element on the computing device that transfers heat generated by the device. The chassis has a liquid cooling subsystem and a mounting element that allows the computing device to move. The chassis receives the heat from the computing device and uses the liquid cooling subsystem to dissipate it.

Original Abstract Submitted

A computing device liquid cooling system includes a multi-device chassis, a computing device, and a multi-device-chassis/device movable coupling liquid cooling system that moveably couples the computing device to the multi-device chassis. The multi-device-chassis/device movable coupling liquid cooling system includes a computing device mounting element that is mounted to the computing device and configured to transfer heat generated by the computing device, a multi-device chassis mounting element that includes a liquid cooling subsystem and that is mounted to the multi-device chassis, and a movable coupling that is configured to allow the computing device mounting element to move relative to the multi-device chassis mounting element. The multi-device chassis mounting element is configured to receive the heat generated by the computing device and transferred by the computing device mounting element, and transfer the heat received from the computing device mounting element using the liquid cooling subsystem.