METHOD VERIFYING PROCESS PROXIMITY CORRECTION USING MACHINE LEARNING, AND SEMICONDUCTOR MANUFACTURING METHOD USING SAME: abstract simplified (17903070)

• This abstract for appeared for patent application number 17903070 Titled 'METHOD VERIFYING PROCESS PROXIMITY CORRECTION USING MACHINE LEARNING, AND SEMICONDUCTOR MANUFACTURING METHOD USING SAME'

Simplified Explanation

The abstract describes a method for manufacturing a semiconductor chip. The process involves creating a layout pattern and then applying Process Proximity Correction (PPC) to generate a corrected layout pattern. Machine learning is used to verify the correctness of the corrected layout pattern. Optical Proximity Correction (OPC) is then applied to the corrected layout pattern to generate a final corrected pattern. A mask is manufactured using this final pattern, and finally, a semiconductor chip is manufactured using the mask.

Original Abstract Submitted

A method of manufacturing a semiconductor chip includes; generating a layout pattern, performing Process Proximity Correction (PPC) on the layout pattern to generate a PPC layout pattern, wherein the performing of PPC includes verifying the PPC layout pattern using machine learning, performing Optical Proximity Correction (OPC) on the PPC layout pattern to generate an OPC layout pattern, manufacturing a mask using the OPC layout pattern, and manufacturing a semiconductor chip using the mask.