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| − | '''Summary of the patent applications from MEDIATEK INC. on November 30th, 2023'''
| + | ==Patent applications for mediatek on November 30th, 2023== |
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| − | MEDIATEK INC. has recently filed several patents related to wireless communication, video encoding, latency reduction in mobile networks, adjusting transmitting power ratio, semiconductor packaging, and voice wakeup detection.
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| − | In the field of wireless communication, one patent application describes a method for transmitting baseband data signals from a user equipment (UE) to a base station via repeaters. The UE generates multiple layers of baseband data signals and maps them to antennas in transmission time intervals. Another patent application focuses on a wireless device that receives a time domain signal from a UE and generates a second time domain signal to be transmitted to a base station on a different frequency band.
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| − | For video encoding, a patent application describes a system that uses shared transform circuits to process input residual signals and generate transform coefficients. This system allows for the reuse of computation resources and implements a hierarchical design for block size grouping.
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| − | In the mobile communication network domain, one patent application presents a method to reduce latency in reporting measurements for positioning. The method avoids triggering additional procedures, resulting in faster and more efficient reporting of measurement results.
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| − | Another patent application focuses on adjusting the transmitting power ratio of a radio module by separating modules into different groups and adjusting the transmitting power limit based on RF exposure limits.
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| − | In terms of semiconductor packaging, one patent application describes a package with multiple semiconductor structures on an interposer over a substrate, while another patent application discusses a semiconductor device with multiple layers and integrated circuits connected through a bridge die. Additionally, there is a patent application for a wafer level chip scale package with a bare silicon die and a backside tape that wraps around the die's corner.
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| − | Lastly, a patent application presents a semiconductor die with an on-die power switch and a target device, where the power switch selects the target operation voltage for the target device.
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| − | Notable Applications:
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| − | * Method for transmitting baseband data signals via repeaters in wireless communication.
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| − | * System for video encoding using shared transform circuits and hierarchical design.
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| − | * Method to reduce latency in reporting measurements for positioning in mobile networks.
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| − | * Method for adjusting the transmitting power ratio of a radio module based on RF exposure limits.
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| − | * Semiconductor packaging with multiple structures and integrated circuits.
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| − | * Semiconductor device with multiple layers and integrated circuits connected through a bridge die.
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| − | * Wafer level chip scale package with a bare silicon die and backside tape.
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| − | * Semiconductor die with an on-die power switch and a target device.
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| − | ==Patent applications for MEDIATEK INC. on November 30th, 2023== | |
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| − | ===METHOD AND APPARATUS FOR PERFORMING CORRELATION COMPUTATION WITH REDUCED COMPLEXITY THROUGH USING COMPOSITE CODE SEQUENCE THAT IS GENERATED FROM PERFORMING BIT-WISE COMBINATION WITH TRANSFORMATION UPON MULTIPLE CODE SEQUENCES ([[US Patent Application 18142568. METHOD AND APPARATUS FOR PERFORMING CORRELATION COMPUTATION WITH REDUCED COMPLEXITY THROUGH USING COMPOSITE CODE SEQUENCE THAT IS GENERATED FROM PERFORMING BIT-WISE COMBINATION WITH TRANSFORMATION UPON MULTIPLE CODE SEQUENCES simplified abstract (MEDIATEK INC.)|18142568]])===
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| − | '''Main Inventor'''
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| − | Kun-Tso Chen
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| − | ===VOICE WAKEUP DETECTING DEVICE AND METHOD ([[US Patent Application 17825250. VOICE WAKEUP DETECTING DEVICE AND METHOD simplified abstract (MEDIATEK INC.)|17825250]])===
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| − | '''Main Inventor'''
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| − | Liang-Che SUN
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| − | ===SEMICONDUCTOR DIE HAVING ON-DIE POWER SWITCH FOR SELECTING TARGET OPERATION VOLTAGE FROM OPERATION VOLTAGES PROVIDED BY DIFFERENT POWER SOURCES ([[US Patent Application 18124576. SEMICONDUCTOR DIE HAVING ON-DIE POWER SWITCH FOR SELECTING TARGET OPERATION VOLTAGE FROM OPERATION VOLTAGES PROVIDED BY DIFFERENT POWER SOURCES simplified abstract (MEDIATEK INC.)|18124576]])===
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| − | '''Main Inventor'''
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| − | Bo-Yun Lin
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| − | ===WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION ([[US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract (MEDIATEK INC.)|18132437]])===
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| − | '''Main Inventor'''
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| − | Yu-Tung Chen
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| − | ===SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 18191092. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (MEDIATEK INC.)|18191092]])===
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| − | '''Main Inventor'''
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| − | Tai-Hao PENG
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| − | ===SEMICONDUCTOR PACKAGE ([[US Patent Application 18303693. SEMICONDUCTOR PACKAGE simplified abstract (MEDIATEK INC.)|18303693]])===
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| − | '''Main Inventor'''
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| − | Yi-Lin TSAI
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| − | ===METHOD FOR ADJUSTING TRANSMITTING POWER RATIO OF RADIO MODULE AND ASSOCIATED RADIO SYSTEM ([[US Patent Application 18136333. METHOD FOR ADJUSTING TRANSMITTING POWER RATIO OF RADIO MODULE AND ASSOCIATED RADIO SYSTEM simplified abstract (MEDIATEK INC.)|18136333]])===
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| − | '''Main Inventor'''
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| − | Fu-Tse Kao
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| − | ===METHODS OF LATENCY REDUCTION FOR POSITIONING-SPECIFIC MEASUREMENT REPORTING ([[US Patent Application 18248911. METHODS OF LATENCY REDUCTION FOR POSITIONING-SPECIFIC MEASUREMENT REPORTING simplified abstract (MEDIATEK INC.)|18248911]])===
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| − | '''Main Inventor'''
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| − | Guan-Yu LIN
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| − | ===COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-REPEATER BEHAVIOR ([[US Patent Application 18141494. COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-REPEATER BEHAVIOR simplified abstract (MEDIATEK INC.)|18141494]])===
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| − | '''Main Inventor'''
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| − | Lung-Sheng Tsai
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| − | ===Transform Architecture in Video Encoding Systems ([[US Patent Application 17825269. Transform Architecture in Video Encoding Systems simplified abstract (MEDIATEK INC.)|17825269]])===
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| − | '''Main Inventor'''
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| − | Chih-Hsuan LO
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| − | ===COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-UE BEHAVIOR ([[US Patent Application 18141498. COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-UE BEHAVIOR simplified abstract (MEDIATEK INC.)|18141498]])===
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| − | '''Main Inventor'''
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| − | Lung-Sheng Tsai
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