Difference between revisions of "MEDIATEK INC. patent applications published on November 30th, 2023"

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'''Summary of the patent applications from MEDIATEK INC. on November 30th, 2023'''
 
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MEDIATEK INC. has recently filed several patents related to wireless communication, video encoding, latency reduction in mobile networks, adjusting transmitting power ratio, semiconductor packaging, and voice wakeup detection.
 
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In the field of wireless communication, one patent application describes a method for transmitting baseband data signals from a user equipment (UE) to a base station via repeaters. The UE generates multiple layers of baseband data signals and maps them to antennas in transmission time intervals. Another patent application focuses on a wireless device that receives a time domain signal from a UE and generates a second time domain signal to be transmitted to a base station on a different frequency band.
 
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For video encoding, a patent application describes a system that uses shared transform circuits to process input residual signals and generate transform coefficients. This system allows for the reuse of computation resources and implements a hierarchical design for block size grouping.
 
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In the mobile communication network domain, one patent application presents a method to reduce latency in reporting measurements for positioning. The method avoids triggering additional procedures, resulting in faster and more efficient reporting of measurement results.
 
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Another patent application focuses on adjusting the transmitting power ratio of a radio module by separating modules into different groups and adjusting the transmitting power limit based on RF exposure limits.
 
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In terms of semiconductor packaging, one patent application describes a package with multiple semiconductor structures on an interposer over a substrate, while another patent application discusses a semiconductor device with multiple layers and integrated circuits connected through a bridge die. Additionally, there is a patent application for a wafer level chip scale package with a bare silicon die and a backside tape that wraps around the die's corner.
 
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Lastly, a patent application presents a semiconductor die with an on-die power switch and a target device, where the power switch selects the target operation voltage for the target device.
 
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Notable Applications:
 
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* Method for transmitting baseband data signals via repeaters in wireless communication.
 
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* System for video encoding using shared transform circuits and hierarchical design.
 
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* Method to reduce latency in reporting measurements for positioning in mobile networks.
 
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* Method for adjusting the transmitting power ratio of a radio module based on RF exposure limits.
 
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* Semiconductor packaging with multiple structures and integrated circuits.
 
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* Semiconductor device with multiple layers and integrated circuits connected through a bridge die.
 
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* Wafer level chip scale package with a bare silicon die and backside tape.
 
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* Semiconductor die with an on-die power switch and a target device.
 
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==Patent applications for MEDIATEK INC. on November 30th, 2023==
 
==Patent applications for MEDIATEK INC. on November 30th, 2023==
  
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===METHOD AND APPARATUS FOR PERFORMING CORRELATION COMPUTATION WITH REDUCED COMPLEXITY THROUGH USING COMPOSITE CODE SEQUENCE THAT IS GENERATED FROM PERFORMING BIT-WISE COMBINATION WITH TRANSFORMATION UPON MULTIPLE CODE SEQUENCES ([[US Patent Application 18142568. METHOD AND APPARATUS FOR PERFORMING CORRELATION COMPUTATION WITH REDUCED COMPLEXITY THROUGH USING COMPOSITE CODE SEQUENCE THAT IS GENERATED FROM PERFORMING BIT-WISE COMBINATION WITH TRANSFORMATION UPON MULTIPLE CODE SEQUENCES simplified abstract|18142568]])===
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===METHOD AND APPARATUS FOR PERFORMING CORRELATION COMPUTATION WITH REDUCED COMPLEXITY THROUGH USING COMPOSITE CODE SEQUENCE THAT IS GENERATED FROM PERFORMING BIT-WISE COMBINATION WITH TRANSFORMATION UPON MULTIPLE CODE SEQUENCES ([[US Patent Application 18142568. METHOD AND APPARATUS FOR PERFORMING CORRELATION COMPUTATION WITH REDUCED COMPLEXITY THROUGH USING COMPOSITE CODE SEQUENCE THAT IS GENERATED FROM PERFORMING BIT-WISE COMBINATION WITH TRANSFORMATION UPON MULTIPLE CODE SEQUENCES simplified abstract (MEDIATEK INC.)|18142568]])===
  
  
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===VOICE WAKEUP DETECTING DEVICE AND METHOD ([[US Patent Application 17825250. VOICE WAKEUP DETECTING DEVICE AND METHOD simplified abstract|17825250]])===
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===VOICE WAKEUP DETECTING DEVICE AND METHOD ([[US Patent Application 17825250. VOICE WAKEUP DETECTING DEVICE AND METHOD simplified abstract (MEDIATEK INC.)|17825250]])===
  
  
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===SEMICONDUCTOR DIE HAVING ON-DIE POWER SWITCH FOR SELECTING TARGET OPERATION VOLTAGE FROM OPERATION VOLTAGES PROVIDED BY DIFFERENT POWER SOURCES ([[US Patent Application 18124576. SEMICONDUCTOR DIE HAVING ON-DIE POWER SWITCH FOR SELECTING TARGET OPERATION VOLTAGE FROM OPERATION VOLTAGES PROVIDED BY DIFFERENT POWER SOURCES simplified abstract|18124576]])===
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===SEMICONDUCTOR DIE HAVING ON-DIE POWER SWITCH FOR SELECTING TARGET OPERATION VOLTAGE FROM OPERATION VOLTAGES PROVIDED BY DIFFERENT POWER SOURCES ([[US Patent Application 18124576. SEMICONDUCTOR DIE HAVING ON-DIE POWER SWITCH FOR SELECTING TARGET OPERATION VOLTAGE FROM OPERATION VOLTAGES PROVIDED BY DIFFERENT POWER SOURCES simplified abstract (MEDIATEK INC.)|18124576]])===
  
  
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===WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION ([[US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract|18132437]])===
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===WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION ([[US Patent Application 18132437. WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION simplified abstract (MEDIATEK INC.)|18132437]])===
  
  
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===SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 18191092. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract|18191092]])===
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===SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF ([[US Patent Application 18191092. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (MEDIATEK INC.)|18191092]])===
  
  
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===SEMICONDUCTOR PACKAGE ([[US Patent Application 18303693. SEMICONDUCTOR PACKAGE simplified abstract|18303693]])===
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===SEMICONDUCTOR PACKAGE ([[US Patent Application 18303693. SEMICONDUCTOR PACKAGE simplified abstract (MEDIATEK INC.)|18303693]])===
  
  
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===METHOD FOR ADJUSTING TRANSMITTING POWER RATIO OF RADIO MODULE AND ASSOCIATED RADIO SYSTEM ([[US Patent Application 18136333. METHOD FOR ADJUSTING TRANSMITTING POWER RATIO OF RADIO MODULE AND ASSOCIATED RADIO SYSTEM simplified abstract|18136333]])===
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===METHOD FOR ADJUSTING TRANSMITTING POWER RATIO OF RADIO MODULE AND ASSOCIATED RADIO SYSTEM ([[US Patent Application 18136333. METHOD FOR ADJUSTING TRANSMITTING POWER RATIO OF RADIO MODULE AND ASSOCIATED RADIO SYSTEM simplified abstract (MEDIATEK INC.)|18136333]])===
  
  
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===METHODS OF LATENCY REDUCTION FOR POSITIONING-SPECIFIC MEASUREMENT REPORTING ([[US Patent Application 18248911. METHODS OF LATENCY REDUCTION FOR POSITIONING-SPECIFIC MEASUREMENT REPORTING simplified abstract|18248911]])===
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===METHODS OF LATENCY REDUCTION FOR POSITIONING-SPECIFIC MEASUREMENT REPORTING ([[US Patent Application 18248911. METHODS OF LATENCY REDUCTION FOR POSITIONING-SPECIFIC MEASUREMENT REPORTING simplified abstract (MEDIATEK INC.)|18248911]])===
  
  
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===COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-REPEATER BEHAVIOR ([[US Patent Application 18141494. COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-REPEATER BEHAVIOR simplified abstract|18141494]])===
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===COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-REPEATER BEHAVIOR ([[US Patent Application 18141494. COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-REPEATER BEHAVIOR simplified abstract (MEDIATEK INC.)|18141494]])===
  
  
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===Transform Architecture in Video Encoding Systems ([[US Patent Application 17825269. Transform Architecture in Video Encoding Systems simplified abstract|17825269]])===
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===Transform Architecture in Video Encoding Systems ([[US Patent Application 17825269. Transform Architecture in Video Encoding Systems simplified abstract (MEDIATEK INC.)|17825269]])===
  
  
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===COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-UE BEHAVIOR ([[US Patent Application 18141498. COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-UE BEHAVIOR simplified abstract|18141498]])===
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===COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-UE BEHAVIOR ([[US Patent Application 18141498. COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-UE BEHAVIOR simplified abstract (MEDIATEK INC.)|18141498]])===
  
  

Revision as of 07:08, 5 December 2023

Contents

Patent applications for MEDIATEK INC. on November 30th, 2023

METHOD AND APPARATUS FOR PERFORMING CORRELATION COMPUTATION WITH REDUCED COMPLEXITY THROUGH USING COMPOSITE CODE SEQUENCE THAT IS GENERATED FROM PERFORMING BIT-WISE COMBINATION WITH TRANSFORMATION UPON MULTIPLE CODE SEQUENCES ([[US Patent Application 18142568. METHOD AND APPARATUS FOR PERFORMING CORRELATION COMPUTATION WITH REDUCED COMPLEXITY THROUGH USING COMPOSITE CODE SEQUENCE THAT IS GENERATED FROM PERFORMING BIT-WISE COMBINATION WITH TRANSFORMATION UPON MULTIPLE CODE SEQUENCES simplified abstract (MEDIATEK INC.)|18142568]])

Main Inventor

Kun-Tso Chen


VOICE WAKEUP DETECTING DEVICE AND METHOD (17825250)

Main Inventor

Liang-Che SUN


SEMICONDUCTOR DIE HAVING ON-DIE POWER SWITCH FOR SELECTING TARGET OPERATION VOLTAGE FROM OPERATION VOLTAGES PROVIDED BY DIFFERENT POWER SOURCES (18124576)

Main Inventor

Bo-Yun Lin


WAFER LEVEL CHIP SCALE PACKAGE WITH SIDEWALL PROTECTION (18132437)

Main Inventor

Yu-Tung Chen


SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF (18191092)

Main Inventor

Tai-Hao PENG


SEMICONDUCTOR PACKAGE (18303693)

Main Inventor

Yi-Lin TSAI


METHOD FOR ADJUSTING TRANSMITTING POWER RATIO OF RADIO MODULE AND ASSOCIATED RADIO SYSTEM (18136333)

Main Inventor

Fu-Tse Kao


METHODS OF LATENCY REDUCTION FOR POSITIONING-SPECIFIC MEASUREMENT REPORTING (18248911)

Main Inventor

Guan-Yu LIN


COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-REPEATER BEHAVIOR (18141494)

Main Inventor

Lung-Sheng Tsai


Transform Architecture in Video Encoding Systems (17825269)

Main Inventor

Chih-Hsuan LO


COOPERATION WITH DIGITAL FREQUENCY-TRANSLATION REPEATER FOR UPLINK TRANSMISSION AND RECEPTION-UE BEHAVIOR (18141498)

Main Inventor

Lung-Sheng Tsai

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