Kioxia corporation (20240096659). SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
Contents
- 1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Fuyuma Ito of Yokkaichi Mie (JP)
Jun Takagi of Yokkaichi Mie (JP)
Yosuke Maruyama of Yokkaichi Mie (JP)
Yuya Akeboshi of Yokkaichi Mie (JP)
Takashi Watanabe of Yokkaichi Mie (JP)
Hiroyasu Iimori of Nagoya Aichi (JP)
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096659 titled 'SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Simplified Explanation
The substrate processing apparatus described in the abstract includes a system of roller pairs for rotating and processing substrates, circulation grooves for supplying chemical solutions, rinse solutions, and drying fluids to the substrates, and a fluid supplier for drying the rinse solution.
- The apparatus includes a plurality of roller pairs for rotating substrates in a horizontal direction.
- Three circulation grooves are provided along the outer peripheral portions of each substrate for supplying chemical solutions, rinse solutions, and drying fluids.
- A chemical solution supplier supplies a chemical solution to the substrates through the first circulation groove.
- A rinse solution supplier supplies a rinse solution to the substrates through the second circulation groove.
- A fluid supplier supplies a fluid for drying the rinse solution to the substrates through the third circulation groove.
Potential Applications
This technology could be used in semiconductor manufacturing processes, where precise and controlled chemical treatments are required for substrate processing.
Problems Solved
This technology solves the problem of efficiently and effectively supplying chemical solutions, rinse solutions, and drying fluids to substrates during processing.
Benefits
The benefits of this technology include improved processing efficiency, better control over chemical treatments, and reduced risk of contamination during substrate processing.
Potential Commercial Applications
Potential commercial applications of this technology include semiconductor fabrication facilities, research laboratories, and other industries requiring precise substrate processing.
Possible Prior Art
One possible prior art for this technology could be similar substrate processing apparatus used in semiconductor manufacturing or other industries where precise chemical treatments are necessary.
Unanswered Questions
How does this technology compare to traditional substrate processing methods?
This article does not provide a direct comparison between this technology and traditional substrate processing methods.
What are the limitations of this substrate processing apparatus?
The article does not address any limitations or drawbacks of this substrate processing apparatus.
Original Abstract Submitted
a substrate processing apparatus includes: a plurality of roller pairs configured to place a plurality of substrates, respectively, wherein the substrates are arranged side by side in a horizontal direction with a predetermined interval, and rotate the plurality of substrates, respectively, in a circumferential direction; a first, second, and third circulation groove that are disposed along outer peripheral portions of each of the plurality of substrates; a chemical solution supplier configured to supply a chemical solution to the outer peripheral portions of the plurality of substrates through the first circulation groove; a rinse solution supplier configured to supply a rinse solution to the outer peripheral portions of the plurality of substrates through the second circulation groove; and a fluid supplier configured to supply a fluid for drying the rinse solution to the outer peripheral portions of the plurality of substrates through the third circulation groove.
