Kioxia corporation (20240096652). SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE simplified abstract
Contents
- 1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Organization Name
Inventor(s)
Mana Tanabe of Setagaya Tokyo (JP)
Kaori Umezawa of Fujisawa Kanagawa (JP)
Kosuke Takai of Yokohama Kanagawa (JP)
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096652 titled 'SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Simplified Explanation
The substrate processing method described in the abstract involves forming a liquid film on a substrate with two different regions, each having a different film material on its outermost surface. The method then solidifies the liquid film and causes the solidified film on one region to melt before the other region.
- Explanation of the patent/innovation:
* Forming a liquid film on a substrate with different film materials on two regions * Solidifying the liquid film to form a solidified film * Causing the solidified film on one region to melt before the other region
Potential Applications
The technology could be applied in semiconductor manufacturing, thin film deposition, and surface modification processes.
Problems Solved
This technology can help in controlling the melting and solidification process of different film materials on a substrate, enabling precise and selective treatments.
Benefits
The method allows for selective melting and solidification of films on different regions of a substrate, providing control over material properties and surface characteristics.
Potential Commercial Applications
- Advanced semiconductor manufacturing processes
- Surface modification techniques in the electronics industry
Possible Prior Art
There may be prior art related to selective melting and solidification processes in thin film deposition or surface treatment technologies.
Unanswered Questions
How does this method compare to traditional film deposition techniques?
This method offers a more controlled and selective approach to modifying surface properties compared to traditional methods that may apply uniform treatments.
What are the potential challenges in scaling up this technology for industrial applications?
Scaling up this technology for mass production may require optimization of process parameters and equipment design to ensure uniform and consistent results across large substrate areas.
Original Abstract Submitted
according to an embodiment, a substrate processing method includes forming a liquid film on a substrate including a first region provided with a first film on an outermost surface thereof and a second region provided with a second film on an outermost surface thereof, the first film and the second film being different from each other in material. the method further includes forming a solidified film by solidifying the liquid film. the method further includes causing the solidified film on the first region to melt prior to the solidified film on the second region.
