Kioxia corporation (20240096644). PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE simplified abstract
Contents
- 1 PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Koki Ueha of Yokkaichi Mie (JP)
Katsuyoshi Kodera of Yokohama Kanagawa (JP)
PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096644 titled 'PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Simplified Explanation
The abstract describes a pattern forming method using a template with recessed portions to mold imprint material on an object.
- The method involves placing imprint material on an object and pressing a template against it to create a pattern.
- The template has specific recessed portions that satisfy a relationship between their depths and distances.
- The molded imprint material is then cured and the template removed.
Potential Applications
This technology could be used in industries such as manufacturing, electronics, and nanotechnology for creating precise patterns on surfaces.
Problems Solved
This method solves the problem of accurately transferring patterns onto objects with high precision and repeatability.
Benefits
The benefits of this technology include improved efficiency in pattern formation, reduced production costs, and enhanced quality control.
Potential Commercial Applications
"Precision Pattern Forming Method for Industrial Applications"
Possible Prior Art
Prior art may include similar methods using templates for molding materials, but the specific relationship between recessed portions as described in this patent may be novel.
Unanswered Questions
How does this method compare to traditional pattern forming techniques?
This article does not provide a direct comparison between this method and traditional techniques in terms of efficiency, cost, or quality.
Are there any limitations to the size or complexity of patterns that can be formed using this method?
The article does not address any potential limitations in terms of the size or complexity of patterns that can be created using this technology.
Original Abstract Submitted
according to one embodiment, a pattern forming method uses a template having a first region with a first recessed portion and a second region adjacent to the first region. the second region has a second recessed portion therein. the recessed portions satisfy a specific relationship (d>2(h+h)/�), where dis a shortest distance between the first and second recessed portions, his a depth of the first recessed portion, and his a depth of the second recessed portion. the pattern forming method includes placing an imprint material on an object and pressing the template against the material to mold the imprint material. the molded imprint material is then cured, and the template removed.
