Kioxia corporation (20240094624). PATTERN FORMATION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND IMPRINT APPARATUS simplified abstract
Contents
- 1 PATTERN FORMATION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND IMPRINT APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PATTERN FORMATION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND IMPRINT APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
PATTERN FORMATION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND IMPRINT APPARATUS
Organization Name
Inventor(s)
Masaki Mitsuyasu of Kuwana Mie (JP)
Anupam Mitra of Yokkaichi Mie (JP)
PATTERN FORMATION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND IMPRINT APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240094624 titled 'PATTERN FORMATION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND IMPRINT APPARATUS
Simplified Explanation
The abstract describes a method for pattern formation on a substrate using alignment marks and adjusting suction force to control substrate warpage.
- The method involves holding a substrate on a suction chuck with outer and inner suction regions.
- Alignment marks are used for position alignment during pressing of a template against a resin film on the substrate.
- Suction force for the outer suction region is adjusted to change substrate warpage and ensure accurate alignment.
Potential Applications
This technology could be applied in the manufacturing of electronic devices, such as displays and semiconductors, where precise alignment of patterns is crucial.
Problems Solved
This method solves the problem of misalignment during pattern formation on substrates, which can lead to defects in electronic devices and reduce their performance.
Benefits
The benefits of this technology include improved accuracy in pattern formation, increased yield in manufacturing processes, and enhanced quality of electronic devices.
Potential Commercial Applications
One potential commercial application of this technology is in the production of high-resolution displays for smartphones, tablets, and other electronic devices.
Possible Prior Art
Prior art may include methods for alignment and pattern formation on substrates using different techniques, such as optical alignment systems or mechanical alignment mechanisms.
Unanswered Questions
How does this method compare to traditional alignment techniques in terms of accuracy and efficiency?
This article does not provide a direct comparison between this method and traditional alignment techniques. Further research or testing may be needed to determine the advantages of this approach over existing methods.
What are the limitations of using suction force adjustment for controlling substrate warpage during pattern formation?
The article does not discuss any potential limitations or challenges associated with using suction force adjustment for controlling substrate warpage. Additional studies or experiments could help identify any drawbacks of this technique.
Original Abstract Submitted
according to one embodiment, a pattern formation method includes holding a substrate on a suction chuck that an outer suction region for an outer edge portion of the substrate and an inner suction region for an inner region of the substrate. a partial shot region at an outer edge of the substrate has a first alignment mark in the inner region and a second alignment mark at the outer edge portion. while a template is being pressed against a resin film in the shot region, position alignment using the second and fourth alignment marks is performed by adjusting a suction force for the outer suction region for changing a warpage amount of the substrate while observing the second and fourth alignment marks through the template.
