Kabushiki kaisha toshiba (20240096973). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Keita Saito of Nonoichi Ishikawa (JP)
Kouta Tomita of Nonoichi Ishikawa (JP)
Tatsuya Nishiwaki of Yokohama Kanagawa (JP)
Yasunobu Saito of Nomi Ishikawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096973 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract consists of multiple electrodes, insulating members, and a conductive member within a semiconductor part. Here is a simplified explanation of the abstract:
- A semiconductor device with multiple electrodes and insulating members
- The device includes a semiconductor part with a first, second, third, fourth, and fifth electrode
- Insulating members are located in the semiconductor part in different regions
- A conductive member is connected to the third, fourth, and fifth electrodes
Potential Applications: This technology could be used in electronic devices such as sensors, transistors, and integrated circuits.
Problems Solved: This technology helps in improving the performance and efficiency of semiconductor devices by providing a structured layout for electrodes and insulating members.
Benefits: The structured layout of electrodes and insulating members can lead to better conductivity, reduced interference, and enhanced overall functionality of semiconductor devices.
Potential Commercial Applications: The optimized layout of electrodes and insulating members in this technology could be beneficial for companies manufacturing electronic components for various industries.
Possible Prior Art: One possible prior art could be the use of similar electrode layouts in semiconductor devices for improved performance and functionality.
Unanswered Questions: 1. What specific materials are used for the electrodes and insulating members in this semiconductor device? 2. How does the conductive member enhance the overall performance of the semiconductor device?
Original Abstract Submitted
a semiconductor device includes: a first electrode; a semiconductor part located on the first electrode; a second electrode located in a first region on the semiconductor part; a third electrode located in a second region on the semiconductor part; an insulating member located in the semiconductor part in the first and second regions; a fourth electrode located in the insulating member in the first and second regions; a fifth electrode located in the insulating member between the first electrode and the fourth electrode in the first and second regions; and a conductive member located at least in the second region. the conductive member is connected to the third, fourth, and fifth electrodes.
