Kabushiki kaisha toshiba (20240096876). SEMICONDUCTOR DEVICE simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Takahiro Nakagawa of Kawasaki Kanagawa (JP)
Kazuya Nishihori of Tokyo (JP)
Yasuhiko Kuriyama of Yokohama Kanagawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096876 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract includes a plurality of transistors coupled through serial coupling, with a first transistor, a second transistor, a third transistor, and a first diode arranged on a substrate. The second transistor consists of a first sub-transistor and a second sub-transistor coupled in parallel, with the third transistor interposed between the first and second sub-transistors in a first direction.
- The semiconductor device includes a unique configuration of transistors and diodes on a substrate.
- The transistors are coupled through serial coupling, with the second transistor having a parallel configuration of sub-transistors.
- The third transistor is positioned between the first and second sub-transistors in a specific direction on the substrate.
Potential Applications
The technology described in this patent application could be applied in:
- Integrated circuits
- Power management systems
- Signal processing devices
Problems Solved
This technology addresses issues related to:
- Efficient transistor coupling
- Space optimization on a substrate
- Enhanced performance of semiconductor devices
Benefits
The benefits of this technology include:
- Improved functionality of semiconductor devices
- Enhanced power efficiency
- Compact design for integrated circuits
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Automotive electronics
- Industrial automation systems
Possible Prior Art
One possible prior art for this technology could be the configuration of transistors and diodes on a substrate in a specific arrangement for optimized performance.
Unanswered Questions
How does this technology compare to traditional transistor configurations in terms of performance and efficiency?
This article does not provide a direct comparison between this technology and traditional transistor configurations. Further research and testing would be needed to determine the specific advantages and disadvantages of this innovation.
What are the potential challenges in scaling up this technology for mass production?
The article does not address the scalability of this technology for mass production. Factors such as manufacturing costs, production yield, and compatibility with existing fabrication processes could pose challenges that need to be explored further.
Original Abstract Submitted
according to one embodiment, a semiconductor device includes a plurality of transistors. the transistors are coupled through serial coupling. the transistors include a first transistor and a second transistor. the semiconductor device further includes a third transistor and a first diode. the second transistor includes a first sub-transistor and a second sub-transistor that are coupled in parallel with each other. the first transistor, the first sub-transistor, the second sub-transistor, the third transistor, and the first diode are arranged on a substrate, with the third transistor interposed between the first sub-transistor and the second sub-transistor in a first direction.
