Kabushiki kaisha toshiba (20240096843). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Kyo Tanabiki of Himeji Hyogo (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096843 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract includes a chip with a first electrode, a first connector above the first electrode, and a joint member for joining the first electrode and the joint portion of the first connector. The joint portion of the first connector has a notch portion on at least one end of its upper surface, and the joint member is in contact with the first electrode and at least part of the notch portion.
- Explanation of the patent:
- Semiconductor device with a unique joint structure for connecting electrodes and connectors.
- Potential applications of this technology:
- Integrated circuits, electronic devices, sensors.
- Problems solved by this technology:
- Improved reliability and performance of semiconductor devices.
- Benefits of this technology:
- Enhanced electrical connectivity, increased durability, and stability.
- Potential commercial applications of this technology:
- Semiconductor manufacturing industry, electronics industry.
- Possible prior art:
- Previous methods of connecting electrodes and connectors in semiconductor devices.
- Unanswered Questions:
- 1. How does this joint structure compare to traditional methods of connecting electrodes and connectors in semiconductor devices?
- Unanswered Questions:
The article does not provide a direct comparison between this new joint structure and traditional methods, leaving the reader to infer the advantages of the new design.
- 2. Are there any specific industries or applications where this technology would be most beneficial?
The article does not specify any particular industries or applications where this technology would have the most significant impact, leaving room for further exploration into potential market niches.
Original Abstract Submitted
according to one embodiment, a semiconductor device includes: a chip; a first electrode provided on the chip; a first connector provided above the first electrode, extending in a first direction, and provided with a joint portion to be joined to the first electrode, on an end portion in the first direction of the first connector; and a joint member for use in joint between the first electrode and the joint portion. the joint portion is provided with a notch portion on at least one end portion in the first direction of an upper surface of the joint portion. the joint member is in contact with the first electrode, a lower surface of the joint portion facing the first electrode, and at least, part of the notch portion.
