International business machines corporation (20240121934). MICROELECTRONIC DEVICE WITH STACKED TRANSISTORS simplified abstract

MICROELECTRONIC DEVICE WITH STACKED TRANSISTORS

Organization Name

international business machines corporation

Inventor(s)

[[:Category:Jens K�nzer of Boeblingen (DE)|Jens K�nzer of Boeblingen (DE)]][[Category:Jens K�nzer of Boeblingen (DE)]]

Tobias Werner of Weil Im Schoenbuch (DE)

Iris Maria Leefken of Dettenhausen (DE)

Gerhard Hellner of Boeblingen (DE)

MICROELECTRONIC DEVICE WITH STACKED TRANSISTORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240121934 titled 'MICROELECTRONIC DEVICE WITH STACKED TRANSISTORS

Simplified Explanation

The abstract describes a patent application for a processor that includes memory cells with stacked transistors connected at a common net and configured to share power lines.

• The processor forms a first power line and a second power line.
• The first memory cell has at least six transistors, with the first pair stacked vertically and connected at a common net transverse to the transistors.
• The first pair of transistors share the first power line.
• The second memory cell also has at least six transistors, with the second pair stacked vertically and connected at a common net transverse to the transistors.
• The second pair of transistors share the second power line.
• The transistors of the first pair operate independently from the second pair.

Potential Applications

This technology could be applied in:

• High-performance computing systems
• Data centers
• Mobile devices

Problems Solved

• Increased memory cell efficiency
• Improved power distribution
• Enhanced processor performance

Benefits

• Higher processing speeds
• Reduced power consumption
• Improved overall system performance

Potential Commercial Applications

Optimized Memory Cell Configuration for Enhanced Processor Performance

Possible Prior Art

There may be prior art related to memory cell configurations and power distribution in processors, but specific examples are not provided in the abstract.

Unanswered Questions

How does this technology impact the overall cost of manufacturing processors?

The abstract does not address the potential cost implications of implementing this memory cell configuration.

Are there any limitations to the scalability of this technology for future processor designs?

The abstract does not mention any potential limitations or challenges related to scaling this technology for future processor advancements.

Original Abstract Submitted

a processor may form a first power line and a second power line. the processor may form a first memory cell with at least six transistors and a second memory cell with at least six transistors. the first pair of transistors of the first memory cell may be stacked vertically and connected at a common net. the common net may be arranged transverse to the first pair of transistors. the first pair of transistors may be configured to share the first power line. the second pair of transistors of the first memory cell may be stacked vertically and connected at a common net. the common net may be arranged transverse to the second pair of transistors. the second pair of transistors may be configured to share the second power line. the transistors of the first pair of transistors are configured to operate independently from the second pair of transistors.