International business machines corporation (20240120271). SKIP VIA WITH LATERAL LINE CONNECTION simplified abstract

SKIP VIA WITH LATERAL LINE CONNECTION

Organization Name

international business machines corporation

Inventor(s)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Koichi Motoyama of Clifton Park NY (US)

Ruilong Xie of Niskayuna NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

SKIP VIA WITH LATERAL LINE CONNECTION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240120271 titled 'SKIP VIA WITH LATERAL LINE CONNECTION

Simplified Explanation

The semiconductor structure described in the abstract includes multiple levels of interconnect wiring and a skip via that extends from the third level to the first level of interconnect wiring, maintaining electrical contact with the second level. The contact area between the skip via and the second level of interconnect wiring is greater than the contact area between the bottom portion of the skip via and the top portion of the first level of interconnect wiring.

• The semiconductor structure includes multiple levels of interconnect wiring.
• A skip via extends from the third level to the first level of interconnect wiring.
• The skip via maintains electrical contact with the second level of interconnect wiring.
• The contact area between the skip via and the second level of interconnect wiring is greater than the contact area between the skip via and the first level of interconnect wiring.

Potential Applications

This technology could be used in:

• Advanced semiconductor devices
• High-performance computing systems
• Integrated circuits

Problems Solved

This technology helps to:

• Improve signal transmission efficiency
• Increase circuit density
• Enhance overall performance of semiconductor structures

Benefits

The benefits of this technology include:

• Enhanced electrical connectivity
• Improved reliability
• Higher integration levels

Potential Commercial Applications

This technology has potential applications in:

• Semiconductor manufacturing industry
• Electronics industry
• Telecommunications industry

Possible Prior Art

There may be prior art related to:

• Multi-level interconnect structures in semiconductor devices
• Skip vias for interconnect wiring in integrated circuits

Unanswered Questions

How does this technology impact power consumption in semiconductor devices?

The abstract does not provide information on the power consumption implications of this technology. Further research is needed to understand its effects on power efficiency.

What are the potential challenges in implementing this technology on a large scale?

The abstract does not address the challenges that may arise when scaling up the production of semiconductor structures with this technology. Additional studies are required to identify and overcome any obstacles in large-scale implementation.

Original Abstract Submitted

a semiconductor structure is presented including a first level of interconnect wiring, a second level of interconnect wiring disposed above the first level of interconnect wiring, a third level of interconnect wiring disposed above the second level of interconnect wiring, and a skip via extending from the third level of interconnect wiring to the first level of interconnect wiring such that a sidewall of the skip via maintains electrical contact with the second level of interconnect wiring. a contact area between the sidewall of the skip via and the second level of interconnect wiring is greater than a contact area between a bottom portion of the skip via and a top portion of the first level of interconnect wiring.