International business machines corporation (20240105788). LOCAL INTERCONNECT AT BACKSIDE TO ENABLE FLEXIBLE ROUTING ACROSS DIFFERENT CELL simplified abstract
Contents
- 1 LOCAL INTERCONNECT AT BACKSIDE TO ENABLE FLEXIBLE ROUTING ACROSS DIFFERENT CELL
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LOCAL INTERCONNECT AT BACKSIDE TO ENABLE FLEXIBLE ROUTING ACROSS DIFFERENT CELL - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
LOCAL INTERCONNECT AT BACKSIDE TO ENABLE FLEXIBLE ROUTING ACROSS DIFFERENT CELL
Organization Name
international business machines corporation
Inventor(s)
Ruilong Xie of Niskayuna NY (US)
Tsung-Sheng Kang of Ballston Lake NY (US)
Daniel Schmidt of Niskayuna NY (US)
Alexander Reznicek of Troy NY (US)
LOCAL INTERCONNECT AT BACKSIDE TO ENABLE FLEXIBLE ROUTING ACROSS DIFFERENT CELL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105788 titled 'LOCAL INTERCONNECT AT BACKSIDE TO ENABLE FLEXIBLE ROUTING ACROSS DIFFERENT CELL
Simplified Explanation
The semiconductor device described in the abstract includes a wafer with source/drain epi regions, a power rail on the backside, a backside contact with a backside local interconnect, and frontside signal wires connected through a front side contact.
- Source/drain epi regions on wafer
- Power rail on backside of wafer
- Backside contact with backside local interconnect
- Frontside signal wires connected through front side contact
Potential Applications
The technology described in this patent application could be applied in the semiconductor industry for the development of advanced integrated circuits and electronic devices.
Problems Solved
This technology solves the problem of efficiently connecting source/drain epi regions on a wafer using a backside local interconnect, improving the performance and reliability of semiconductor devices.
Benefits
The benefits of this technology include enhanced connectivity, increased efficiency, improved performance, and greater reliability in semiconductor devices.
Potential Commercial Applications
The potential commercial applications of this technology could include the production of high-performance microprocessors, memory chips, and other semiconductor devices for various electronic applications.
Possible Prior Art
One possible prior art for this technology could be the use of backside contacts in semiconductor devices to improve connectivity and performance.
Original Abstract Submitted
a semiconductor device includes a wafer having at least two source/drain (s/d) epi regions. a power rail is arranged on a backside of the wafer. a backside contact (bsca) has a first portion including a backside local interconnect configured to connect the s/d epi regions together. a plurality of frontside signal wires are connected to the backside local interconnect through a first front side contact.
