View source for International business machines corporation (20240105614). TRANSISTORS WITH ENHANCED VIA-TO-BACKSIDE POWER RAIL simplified abstract

=TRANSISTORS WITH ENHANCED VIA-TO-BACKSIDE POWER RAIL=


==Organization Name==

[[:Category:international business machines corporation|international business machines corporation]]


[[Category:international business machines corporation]]

==Inventor(s)==

[[:Category:Ruilong Xie of Niskayuna NY (US)|Ruilong Xie of Niskayuna NY (US)]][[Category:Ruilong Xie of Niskayuna NY (US)]]

[[:Category:Koichi Motoyama of Clifton Park NY (US)|Koichi Motoyama of Clifton Park NY (US)]][[Category:Koichi Motoyama of Clifton Park NY (US)]]

[[:Category:Feng Liu of Niskayuna NY (US)|Feng Liu of Niskayuna NY (US)]][[Category:Feng Liu of Niskayuna NY (US)]]

==TRANSISTORS WITH ENHANCED VIA-TO-BACKSIDE POWER RAIL - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240105614 titled 'TRANSISTORS WITH ENHANCED VIA-TO-BACKSIDE POWER RAIL

==Simplified Explanation==

The semiconductor structure described in the abstract includes a first via-to-backside power rail with a lower portion connected to a first backside power rail and an upper portion with a smaller width than the lower portion.

* The semiconductor structure features a first via-to-backside power rail with two distinct portions.
* The lower portion of the power rail is connected to a first backside power rail.
* The upper portion of the power rail has a width that is smaller than the lower portion.

== Potential Applications ==
This technology could be applied in:
* Semiconductor manufacturing
* Power distribution systems
* Electronic devices

== Problems Solved ==
This technology helps address issues related to:
* Power distribution efficiency
* Space constraints in semiconductor structures
* Improving overall performance of electronic devices

== Benefits ==
The benefits of this technology include:
* Enhanced power distribution capabilities
* Improved space utilization in semiconductor structures
* Increased efficiency in electronic devices

== Potential Commercial Applications ==
Potential commercial applications of this technology could include:
* Semiconductor industry
* Electronics manufacturing companies
* Power management systems

== Possible Prior Art ==
One possible prior art for this technology could be:
* Existing semiconductor structures with similar power distribution configurations

== Unanswered Questions ==
=== How does this technology compare to existing power distribution methods in semiconductor structures? ===
This article does not provide a direct comparison to existing power distribution methods, leaving room for further analysis and research.

=== What are the specific dimensions and materials used in the construction of the first via-to-backside power rail? ===
The article does not delve into the specific dimensions and materials used in the construction of the power rail, which could be crucial for understanding its practical implementation.


==Original Abstract Submitted==

a semiconductor structure includes a first via-to-backside power rail having a lower portion and an upper portion. the lower portion is connected to a first backside power rail and has a first width and the upper portion has a second width less than the first width.



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