International business machines corporation (20240105614). TRANSISTORS WITH ENHANCED VIA-TO-BACKSIDE POWER RAIL simplified abstract
Contents
- 1 TRANSISTORS WITH ENHANCED VIA-TO-BACKSIDE POWER RAIL
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TRANSISTORS WITH ENHANCED VIA-TO-BACKSIDE POWER RAIL - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
TRANSISTORS WITH ENHANCED VIA-TO-BACKSIDE POWER RAIL
Organization Name
international business machines corporation
Inventor(s)
Ruilong Xie of Niskayuna NY (US)
Koichi Motoyama of Clifton Park NY (US)
TRANSISTORS WITH ENHANCED VIA-TO-BACKSIDE POWER RAIL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105614 titled 'TRANSISTORS WITH ENHANCED VIA-TO-BACKSIDE POWER RAIL
Simplified Explanation
The semiconductor structure described in the abstract includes a first via-to-backside power rail with a lower portion connected to a first backside power rail and an upper portion with a smaller width than the lower portion.
- The semiconductor structure features a first via-to-backside power rail with two distinct portions.
- The lower portion of the power rail is connected to a first backside power rail.
- The upper portion of the power rail has a width that is smaller than the lower portion.
Potential Applications
This technology could be applied in:
- Semiconductor manufacturing
- Power distribution systems
- Electronic devices
Problems Solved
This technology helps address issues related to:
- Power distribution efficiency
- Space constraints in semiconductor structures
- Improving overall performance of electronic devices
Benefits
The benefits of this technology include:
- Enhanced power distribution capabilities
- Improved space utilization in semiconductor structures
- Increased efficiency in electronic devices
Potential Commercial Applications
Potential commercial applications of this technology could include:
- Semiconductor industry
- Electronics manufacturing companies
- Power management systems
Possible Prior Art
One possible prior art for this technology could be:
- Existing semiconductor structures with similar power distribution configurations
Unanswered Questions
How does this technology compare to existing power distribution methods in semiconductor structures?
This article does not provide a direct comparison to existing power distribution methods, leaving room for further analysis and research.
What are the specific dimensions and materials used in the construction of the first via-to-backside power rail?
The article does not delve into the specific dimensions and materials used in the construction of the power rail, which could be crucial for understanding its practical implementation.
Original Abstract Submitted
a semiconductor structure includes a first via-to-backside power rail having a lower portion and an upper portion. the lower portion is connected to a first backside power rail and has a first width and the upper portion has a second width less than the first width.
