International business machines corporation (20240105506). LOCAL LINE EXTENSION FOR ENLARGED VIA-TO-LINE CONTACT AREA simplified abstract

LOCAL LINE EXTENSION FOR ENLARGED VIA-TO-LINE CONTACT AREA

Organization Name

international business machines corporation

Inventor(s)

Brent A. Anderson of Jericho VT (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Ruilong Xie of Niskayuna NY (US)

Reinaldo Vega of Mahopac NY (US)

Albert M. Chu of Nashua NH (US)

LOCAL LINE EXTENSION FOR ENLARGED VIA-TO-LINE CONTACT AREA - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240105506 titled 'LOCAL LINE EXTENSION FOR ENLARGED VIA-TO-LINE CONTACT AREA

Simplified Explanation

The interconnect structure in the patent application includes metal layers with metal wires and vias connecting them. The vias have a width larger than the metal wire segments they connect but smaller than the adjacent metal wire segments.

• The interconnect structure comprises metal layers with metal wires and vias.
• The vias have a width larger than the metal wire segments they connect but smaller than the adjacent metal wire segments.

Potential Applications

This technology could be applied in:

• Semiconductor manufacturing
• Integrated circuit design

Problems Solved

This technology helps in:

• Improving signal transmission efficiency
• Reducing resistance in interconnect structures

Benefits

The benefits of this technology include:

• Enhanced performance of electronic devices
• Increased reliability of interconnect structures

Potential Commercial Applications

Optimized for SEO: "Commercial Applications of Interconnect Structure Technology"

• Consumer electronics
• Telecommunications industry

Possible Prior Art

There may be prior art related to:

• Metal interconnect structures in semiconductor devices
• Vias connecting metal layers in integrated circuits

How does this technology impact the overall size of electronic devices?

This technology could potentially reduce the size of electronic devices by optimizing the interconnect structure, but the exact impact would depend on the specific application and design.

What materials are typically used in the fabrication of the metal wires and vias in interconnect structures?

The materials used in the fabrication of metal wires and vias can vary depending on the requirements of the application, but common materials include copper, aluminum, and tungsten.

Original Abstract Submitted

an interconnect structure includes a first metal layer comprising at least one metal wire with a first segment and a local extension having a width in a first direction that is larger than a width of the first segment. a second metal layer is on top or below the first metal layer comprising at least one metal wire. a via is connected between the at least one metal wire of the first metal layer and the at least one metal wire of the second metal layer. a width of the via in the first direction is larger than the width of the first segment but smaller than a width of the second segment