International business machines corporation (20240104414). EDGE CAPACITIVE COUPLING FOR QUANTUM CHIPS simplified abstract
Contents
- 1 EDGE CAPACITIVE COUPLING FOR QUANTUM CHIPS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 EDGE CAPACITIVE COUPLING FOR QUANTUM CHIPS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
EDGE CAPACITIVE COUPLING FOR QUANTUM CHIPS
Organization Name
international business machines corporation
Inventor(s)
Muir Kumph of Croton on Hudson NY (US)
Oliver Dial of Yorktown Heights NY (US)
John Michael Cotte of New Fairfield CT (US)
David Abraham of Croton NY (US)
EDGE CAPACITIVE COUPLING FOR QUANTUM CHIPS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240104414 titled 'EDGE CAPACITIVE COUPLING FOR QUANTUM CHIPS
Simplified Explanation
The abstract describes a quantum computing chip device with an edge-based capacitive, intra-chip connection between two chips.
- The first chip has a signal line positioned near its edge, while the second chip has a signal line aligned for a capacitive bus connection to the first chip.
- The signal lines on both chips conduct signals between them using a capacitive connection.
Potential Applications
This technology could be applied in quantum computing systems, high-speed data processing, and advanced communication devices.
Problems Solved
This innovation solves the challenge of establishing efficient and fast connections between quantum computing chips within a device.
Benefits
The edge-based capacitive connection allows for high-speed signal transmission, reduced signal loss, and improved overall performance of quantum computing systems.
Potential Commercial Applications
Potential commercial applications include quantum computers, supercomputers, data centers, and telecommunications infrastructure.
Possible Prior Art
Prior art may include research on capacitive connections in electronic devices and advancements in quantum computing chip design.
Unanswered Questions
How does this technology compare to traditional inter-chip connections in terms of speed and efficiency?
This article does not provide a direct comparison between the edge-based capacitive connection and traditional inter-chip connections.
What are the potential limitations or drawbacks of using capacitive bus connections in quantum computing chips?
The article does not address any potential limitations or drawbacks associated with the use of capacitive bus connections in quantum computing chips.
Original Abstract Submitted
a quantum computing chip device provides an edge based capacitive, intra-chip connection. a first chip includes a first signal line with a distal end positioned proximate to or on an edge of the first chip and a proximal end positioned away from the edge of the first chip. a second chip includes a second signal line with a distal end positioned proximate to or on an edge of the second chip and a proximal end positioned away from the edge of the second chip. the first signal line and the second signal line are configured to conduct a signal. the second signal line of the second chip is disposed in alignment for a capacitive bus connection to the first signal line of the first chip.
