International business machines corporation (20240096801). POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT simplified abstract
Contents
- 1 POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT
Organization Name
international business machines corporation
Inventor(s)
Nicholas Anthony Lanzillo of Wynantskill NY (US)
David Wolpert of Poughkeepsie NY (US)
Lawrence A. Clevenger of Saratoga Springs NY (US)
POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240096801 titled 'POWER DELIVERY NETWORK HAVING SUPER VIAS IN AN INTEGRATED CIRCUIT
Simplified Explanation
The abstract describes a patent application related to the development of an integrated circuit, specifically focusing on the power distribution network within the IC. The innovation involves the use of super vias to connect non-adjacent metal layers in the power distribution network, based on the power demand associated with each cell in the IC.
- The patent application involves obtaining a power distribution network for an integrated circuit, which includes multiple metal vias connecting adjacent metal layers.
- Cells are placed on each metal layer of the IC, and the power demand for each cell is identified.
- The power distribution network is updated based on the power demand of each cell, replacing some metal vias with super vias that connect non-adjacent metal layers.
Potential Applications
The technology could be applied in the development of more efficient and optimized integrated circuits for various electronic devices.
Problems Solved
This technology helps in improving the power distribution within integrated circuits, ensuring that power demands are met effectively and efficiently.
Benefits
The use of super vias can enhance the performance and reliability of integrated circuits by providing a more robust power distribution network.
Potential Commercial Applications
This technology could be valuable in the semiconductor industry for the production of advanced and high-performance integrated circuits.
Possible Prior Art
Prior art in the field of integrated circuit design may include existing methods for power distribution network optimization and metal via placement.
Unanswered Questions
How does this technology impact the overall power efficiency of integrated circuits?
The use of super vias in the power distribution network could potentially improve power efficiency by reducing resistance and optimizing power delivery pathways within the IC.
What are the potential challenges in implementing super vias in integrated circuits on a large scale?
One challenge could be the complexity of design and manufacturing processes involved in incorporating super vias, as well as the potential impact on overall IC performance and reliability.
Original Abstract Submitted
embodiments include super via placement in the development of an integrated circuit. aspects of the invention include obtaining a power distribution network for the integrated circuit (ic) ic, wherein the pdn includes a plurality of metal vias each configured to connect adjacent metal layers of a plurality of metal layers. aspects also include placing one or more cells on each metal layer of the ic and identifying a power demand associated with each of the one or more cells. aspects further include updating the pdn, based on the power demand associated with each of the one or more cells, to replace at least two of the plurality of metal vias with a super via that is configured to connect non-adjacent metal layers of the plurality of metal layers.
