International business machines corporation (20240096786). SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT simplified abstract

SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT

Organization Name

international business machines corporation

Inventor(s)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Brent A. Anderson of Jericho VT (US)

Albert M. Chu of Nashua NH (US)

Reinaldo Vega of Mahopac NY (US)

Ruilong Xie of Niskayuna NY (US)

SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240096786 titled 'SUBTRACTIVES LINES AND VIAS WITH WRAP-AROUND CONTACT

Simplified Explanation

The abstract describes an interconnect structure for connecting an upper wiring line to a lower wiring line using a via and a wrap-around via portion.

• The interconnect structure connects an upper wiring line to a lower wiring line.
• It includes a via that connects the lower portion of the upper wiring line with the upper surface of the lower wiring line.
• The structure also features a wrap-around via portion that extends along and electrically contacts a portion of the sides of the lower wiring line.

Potential Applications

The technology described in this patent application could be applied in the following areas:

• Semiconductor manufacturing
• Integrated circuit design
• Electronics industry

Problems Solved

The interconnect structure addresses the following issues:

• Efficiently connecting upper and lower wiring lines
• Ensuring electrical contact between different layers of wiring
• Improving signal transmission in electronic devices

Benefits

The benefits of this technology include:

• Enhanced performance of electronic devices
• Increased reliability of interconnects
• Simplified manufacturing processes

Potential Commercial Applications

This technology could be commercially applied in:

• Semiconductor fabrication facilities
• Electronics manufacturing companies
• Research and development labs

Possible Prior Art

One possible prior art for this technology could be existing methods of connecting upper and lower wiring lines in semiconductor devices. However, the specific design of the wrap-around via portion may be a novel aspect of this innovation.

Unanswered Questions

How does this interconnect structure compare to traditional methods of connecting wiring lines in terms of performance and reliability?

The article does not provide a direct comparison between this interconnect structure and traditional methods.

Are there any limitations or drawbacks to using this interconnect structure in practical applications?

The article does not mention any potential limitations or drawbacks associated with the implementation of this technology.

Original Abstract Submitted

an interconnect structure for connecting an upper wiring line to a lower wiring line includes a via connecting a lower portion of the upper wiring line with an upper surface of the lower wiring line and a wrap-around via portion formed integrally with the via, the wrap-around portion extending along and electrically contacting a portion of the sides of the lower wiring line.