International business machines corporation (20240096752). VIA RESISTANCE TO BACKSIDE POWER RAIL simplified abstract

VIA RESISTANCE TO BACKSIDE POWER RAIL

Organization Name

international business machines corporation

Inventor(s)

Tao Li of Slingerlands NY (US)

Sagarika Mukesh of ALBANY NY (US)

Liqiao Qin of ALBANY NY (US)

Prabudhya Roy Chowdhury of ALBANY NY (US)

Kisik Choi of Watervliet NY (US)

Ruilong Xie of Niskayuna NY (US)

VIA RESISTANCE TO BACKSIDE POWER RAIL - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240096752 titled 'VIA RESISTANCE TO BACKSIDE POWER RAIL

Simplified Explanation

The semiconductor device described in the abstract includes a unique via structure that electrically connects the backside power rail with the transistor source/drain structure. The via has a buried portion that overlaps and contacts the backside of the source/drain structure, a side portion that extends along a vertical side of the structure, and a top portion that covers part of the frontside of the structure.

• The semiconductor device includes a backside power rail.
• The device has a transistor source/drain structure with a backside facing the backside power rail and a frontside facing away from the power rail.
• A via is disposed between and electrically connects the backside power rail and the source/drain structure.
• The via has a buried portion that overlaps and contacts the backside of the source/drain structure.
• The via also includes a side portion that extends along a vertical side of the source/drain structure and a top portion that covers part of the frontside of the structure.

Potential Applications

This technology could be applied in:

• Semiconductor manufacturing
• Power management systems
• Integrated circuits

Problems Solved

This innovation helps in:

• Improving electrical connectivity in semiconductor devices
• Enhancing power distribution efficiency
• Reducing resistance and heat generation in the device

Benefits

The benefits of this technology include:

• Enhanced performance of semiconductor devices
• Increased reliability and durability
• Improved power efficiency

Potential Commercial Applications

Potential commercial applications of this technology could be in:

• Consumer electronics
• Automotive industry
• Telecommunications sector

Possible Prior Art

There may be prior art related to:

• Via structures in semiconductor devices
• Power rail connections in transistor structures

How does this technology impact the overall efficiency of the semiconductor device?

This technology improves the efficiency of the device by enhancing electrical connectivity and reducing resistance, leading to better power distribution and performance.

What are the potential cost implications of implementing this technology in semiconductor manufacturing processes?

The cost implications of implementing this technology may include initial investment in equipment and training, but the long-term benefits in terms of improved device performance and reliability may outweigh the costs.

Original Abstract Submitted

a semiconductor device includes a backside power rail; a transistor source/drain structure that has a backside facing the backside power rail and has a frontside facing away from the backside power rail; and a via disposed between and electrically connecting the backside power rail and the source/drain structure. the via includes a buried portion that is disposed between the backside power rail and the backside of the transistor source/drain structure. a part of the buried portion overlaps and contacts at least a part of the backside of the source/drain structure. the via also includes a side portion that is electrically connected with the buried portion and extends along a vertical side of the source/drain structure between the frontside and the backside; and a top portion that is electrically connected with the side portion and covers at least a part of the frontside of the source/drain structure.