Intel corporation (20240136323). MICROELECTRONIC ASSEMBLIES simplified abstract
Contents
- 1 MICROELECTRONIC ASSEMBLIES
MICROELECTRONIC ASSEMBLIES
Organization Name
Inventor(s)
Shawna M. Liff of Scottsdale AZ (US)
Adel A. Elsherbini of Tempe AZ (US)
Johanna M. Swan of Scottsdale AZ (US)
Arun Chandrasekhar of Chandler AZ (US)
MICROELECTRONIC ASSEMBLIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136323 titled 'MICROELECTRONIC ASSEMBLIES
Simplified Explanation
The abstract of the patent application describes a microelectronic assembly involving a package substrate and a die with conductive contacts and non-solder interconnects.
- Package substrate with first and second surfaces
- Die secured to the package substrate
- Die has first and second conductive contacts
- First conductive contacts connected to package substrate via non-solder interconnects
Potential Applications
This technology could be applied in:
- Consumer electronics
- Automotive electronics
- Medical devices
Problems Solved
This technology helps in:
- Improving reliability of microelectronic assemblies
- Enhancing electrical connectivity
- Reducing the risk of short circuits
Benefits
The benefits of this technology include:
- Increased durability
- Enhanced performance
- Cost-effective manufacturing
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Semiconductor industry
- Telecommunications sector
- Aerospace and defense
Possible Prior Art
One possible prior art could be the use of solder interconnects in microelectronic assemblies.
Unanswered Questions
How does this technology compare to traditional solder interconnects in terms of reliability and performance?
This article does not provide a direct comparison between non-solder interconnects and traditional solder interconnects in terms of reliability and performance.
What are the specific materials used for the non-solder interconnects in this technology?
The article does not specify the exact materials used for the non-solder interconnects in this technology.
Original Abstract Submitted
microelectronic assemblies, and related devices and methods, are disclosed herein. for example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.
