Intel corporation (20240136269). ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE simplified abstract
Contents
- 1 ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
Organization Name
Inventor(s)
Seok Ling Lim of Kulim Kedah (MY)
Jenny Shio Yin Ong of Bayan Lepas (MY)
Jackson Chung Peng Kong of Tanjung Tokong (MY)
ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136269 titled 'ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
Simplified Explanation
The patent application describes a device with a package substrate containing at least one opening and an interconnect structure with a first segment extending under the package substrate and beyond its footprint, and a second segment extending vertically from the first segment and partially through the opening in the package substrate.
- The device includes a package substrate with at least one opening.
- An interconnect structure is present, consisting of a first segment extending under the package substrate and beyond its footprint.
- The interconnect structure also includes a second segment that extends vertically from the first segment and partially through the opening in the package substrate.
Potential Applications
The technology described in this patent application could be applied in:
- Semiconductor packaging
- Microelectronics
- Integrated circuits
Problems Solved
This technology helps in:
- Improving interconnectivity in electronic devices
- Enhancing signal transmission efficiency
- Reducing footprint size of electronic components
Benefits
The benefits of this technology include:
- Increased performance of electronic devices
- Enhanced reliability of interconnect structures
- Potential for miniaturization of electronic components
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Telecommunications
- Automotive electronics
Possible Prior Art
One possible prior art for this technology could be:
- Existing interconnect structures in semiconductor packaging
- Previous methods for improving signal transmission efficiency in electronic devices
Unanswered Questions
How does this technology compare to existing interconnect structures in terms of performance and reliability?
This article does not provide a direct comparison with existing interconnect structures to assess performance and reliability.
What specific electronic devices or industries could benefit the most from this technology?
The article does not specify the specific electronic devices or industries that could benefit the most from the described technology.
Original Abstract Submitted
a device is provided, including a package substrate including at least one opening extending through the package substrate, and an interconnect structure including a first segment and a second segment. the first segment may extend under a bottom surface of the package substrate and may further extend beyond a footprint of the package substrate. the second segment may extend vertically from the first segment and may extend at least partially through the at least one opening of the package substrate.
