Intel corporation (20240128256). MULTI-CHIP PACKAGING simplified abstract
Contents
- 1 MULTI-CHIP PACKAGING
MULTI-CHIP PACKAGING
Organization Name
Inventor(s)
Robert L. Sankman of Phoenix AZ (US)
Sairam Agraharam of Chandler AZ (US)
Shengquan Ou of Chandler AZ (US)
Thomas J. De Bonis of Tempe AZ (US)
Todd Spencer of Chandler AZ (US)
Guotao Wang of Chandler AZ (US)
MULTI-CHIP PACKAGING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128256 titled 'MULTI-CHIP PACKAGING
Simplified Explanation
The abstract describes an electronic device with two dies connected by a bridge interconnect, facilitating electrical communication between them.
- The electronic device includes a first die with a first set of die contacts.
- The electronic device also includes a second die with a second set of die contacts.
- A bridge interconnect is present with a first set of bridge contacts directly coupled to the first set of die contacts and a second set of bridge contacts directly coupled to the second set of die contacts.
- The bridge interconnect helps in enabling electrical communication between the first die and the second die.
Potential Applications
The technology described in this patent application could be applied in:
- Integrated circuits
- Microprocessors
- Memory modules
Problems Solved
This technology helps in:
- Improving electrical communication between different components
- Enhancing the performance of electronic devices
- Facilitating miniaturization of electronic components
Benefits
The benefits of this technology include:
- Increased efficiency in electronic devices
- Enhanced reliability of connections
- Potential for smaller and more compact devices
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Consumer electronics
- Telecommunications equipment
- Automotive electronics
Possible Prior Art
One possible prior art for this technology could be the use of wire bonding or flip-chip technology in electronic devices.
Unanswered Questions
How does this technology impact the overall cost of electronic devices?
The cost implications of implementing this technology in electronic devices are not addressed in the abstract. It would be important to understand if the benefits outweigh the potential increase in manufacturing costs.
What are the environmental implications of using this technology?
The environmental impact of the materials used in the bridge interconnect, such as solder, and the overall sustainability of the electronic devices incorporating this technology are not discussed in the abstract. It would be essential to consider the eco-friendliness of the manufacturing process and the end-of-life disposal of such devices.
Original Abstract Submitted
an electronic device may include a first die that may include a first set of die contacts. the electronic device may include a second die that may include a second set of die contacts. the electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. the first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). the second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). the bridge interconnect may help facilitate electrical communication between the first die and the second die.
