View source for Intel corporation (20240128253). LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL simplified abstract

=LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL=


==Organization Name==

[[:Category:intel corporation|intel corporation]]


[[Category:intel corporation]]

==Inventor(s)==

[[:Category:Denis Myasishchev of Chandler AZ (US)|Denis Myasishchev of Chandler AZ (US)]][[Category:Denis Myasishchev of Chandler AZ (US)]]

[[:Category:Andrew V. Mazur of Tempe AZ (US)|Andrew V. Mazur of Tempe AZ (US)]][[Category:Andrew V. Mazur of Tempe AZ (US)]]

[[:Category:Purushotham Kaushik Muthur Srinath of Chandler AZ (US)|Purushotham Kaushik Muthur Srinath of Chandler AZ (US)]][[Category:Purushotham Kaushik Muthur Srinath of Chandler AZ (US)]]

[[:Category:Robert M. Nickerson of Chandler AZ (US)|Robert M. Nickerson of Chandler AZ (US)]][[Category:Robert M. Nickerson of Chandler AZ (US)]]

[[:Category:Shripad Gokhale of Gilbert AZ (US)|Shripad Gokhale of Gilbert AZ (US)]][[Category:Shripad Gokhale of Gilbert AZ (US)]]

==LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240128253 titled 'LASER ABLATION-BASED SURFACE PROPERTY MODIFICATION AND CONTAMINATION REMOVAL

==Simplified Explanation==

The abstract describes an electronic package with a mold layer, embedded die, and solder resist with cavities.

* The electronic package includes a mold layer and a die embedded within it.
* A solder resist is present with a first surface over the mold layer and a second surface with cavities.

== Potential Applications ==
The technology described in this patent application could be used in various electronic devices such as smartphones, tablets, laptops, and other consumer electronics.

== Problems Solved ==
This technology helps in protecting the embedded die and ensuring proper functioning of the electronic package by providing a protective layer and cavities for components.

== Benefits ==
The benefits of this technology include improved durability, protection of sensitive components, and enhanced performance of electronic devices.

== Potential Commercial Applications ==
The technology could be applied in the manufacturing of electronic devices, leading to more reliable and robust products in the market.

== Possible Prior Art ==
One possible prior art could be the use of traditional electronic packaging methods without the specific features described in this patent application.

=== Unanswered Questions ===

=== How does this technology compare to existing electronic packaging methods? ===
This technology offers improved protection and performance for electronic packages compared to traditional methods.

=== What are the specific dimensions and materials used in the electronic package described in the patent application? ===
The patent application does not provide detailed information on the specific dimensions and materials used in the electronic package.


==Original Abstract Submitted==

embodiments disclosed herein include electronic packages. in an embodiment, the electronic package comprises a mold layer and a die embedded in the mold layer. in an embodiment the electronic package further comprises a solder resist with a first surface over the mold layer and a second surface opposite from the first surface. in an embodiment, the second surface comprises a first cavity into the solder resist.



[[Category:H01L25/18]]
[[Category:H01L23/31]]
[[Category:H01L25/065]]