Intel corporation (20240113019). SPLIT VIA STRUCTURES COUPLED TO CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract

SPLIT VIA STRUCTURES COUPLED TO CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

Organization Name

intel corporation

Inventor(s)

Leonard P. Guler of Hillsboro OR (US)

Mohit K. Haran of Hillsboro OR (US)

Nikhil Mehta of Portland OR (US)

Charles H. Wallace of Portland OR (US)

Tahir Ghani of Portland OR (US)

Sukru Yemenicioglu of Portland OR (US)

SPLIT VIA STRUCTURES COUPLED TO CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240113019 titled 'SPLIT VIA STRUCTURES COUPLED TO CONDUCTIVE LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION

Simplified Explanation

The integrated circuit structure described in the abstract includes multiple conductive lines in a specific arrangement within different layers of dielectric material, with vias connecting the lines. The vias have straight edges and are positioned in a way that allows for efficient signal transmission.

• The integrated circuit structure consists of multiple conductive lines in a specific layout within dielectric layers.
• Vias with straight edges connect the conductive lines in a precise manner for optimal signal transmission.

Potential Applications

This technology could be applied in the manufacturing of advanced integrated circuits for various electronic devices, such as smartphones, computers, and IoT devices.

Problems Solved

This technology solves the problem of efficiently connecting multiple conductive lines in a compact space within an integrated circuit structure.

Benefits

The benefits of this technology include improved signal transmission efficiency, reduced signal interference, and overall enhanced performance of integrated circuits.

Potential Commercial Applications

The potential commercial applications of this technology include the production of high-performance electronic devices with advanced integrated circuits for consumer electronics, telecommunications, and industrial applications.

Possible Prior Art

One possible prior art in this field is the use of similar techniques for connecting conductive lines in integrated circuit structures, but with less precise and efficient via designs compared to the described technology.

How does this technology impact the overall size of integrated circuits?

The abstract does not provide information on how this technology affects the size of integrated circuits. It would be interesting to know if this innovation allows for more compact designs or if it has any impact on the overall size of the circuits.

What are the potential challenges in implementing this technology on a large scale?

The abstract does not address the potential challenges that may arise when implementing this technology on a large scale in the production of integrated circuits. It would be important to understand any obstacles that manufacturers may face when adopting this innovation.

Original Abstract Submitted

embodiments of the disclosure are in the field of integrated circuit structure fabrication. in an example, an integrated circuit structure includes a plurality of conductive lines in a first inter-layer dielectric (ild) layer, the plurality of conductive lines on a same level and along a same direction. a second ild layer is over the plurality of conductive lines and over the first ild layer. a first conductive via is in a first opening in the second ild layer, the first conductive via in contact with a first one of the plurality of conductive lines, the first conductive via having a straight edge. a second conductive via is in a second opening in the second ild layer, the second conductive via in contact with a second one of the plurality of conductive lines, the second one of the plurality of conductive lines laterally spaced apart from the first one of the plurality of conductive lines, and the second conductive via having a straight edge, the straight edge of the second conductive via facing the straight edge of the first conductive via.