Intel corporation (20240113033). DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE simplified abstract
Contents
- 1 DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE
Organization Name
Inventor(s)
Eng Huat Goh of Ayer Itam (MY)
Hazwani Jaffar of Kepala Batas (MY)
DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113033 titled 'DYNAMIC RANDOM-ACCESS MEMORY IN A MOLDING BENEATH A DIE
Simplified Explanation
The abstract describes a patent application related to a package that includes a processor die and one or more memory dies on opposite sides of a substrate, with the memory dies potentially being within a molding.
- Processor die and memory dies are coupled with opposite sides of a substrate.
- Memory dies may be partially or completely within a molding.
- Memory dies may be directly below the processor die on the substrate plane.
Potential Applications
This technology could be applied in:
- High-performance computing systems
- Data centers
- Embedded systems
Problems Solved
This technology helps in:
- Increasing memory capacity in a compact package
- Improving data processing speed and efficiency
Benefits
The benefits of this technology include:
- Enhanced overall system performance
- Reduced footprint for memory and processor integration
- Improved thermal management due to compact design
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Server farms
- Supercomputers
- High-speed data processing applications
Possible Prior Art
There may be prior art related to:
- Multi-die packaging technologies
- Memory and processor integration techniques
Unanswered Questions
How does this technology impact power consumption in comparison to traditional packaging methods?
This article does not provide information on the power consumption implications of this technology.
Are there any limitations to the size or number of memory dies that can be integrated using this packaging method?
The article does not address any potential limitations on the size or number of memory dies that can be integrated in this packaging method.
Original Abstract Submitted
embodiments herein relate to systems, apparatuses, or processes directed to a package that includes a die, which may be a processor die, coupled with a first side of a substrate and one or more dies, which may be one or more memory dies, that are coupled with a second side of the substrate opposite the first side of the substrate. all or part of the memory dies may be directly below the die with respect to a plane of the substrate and may be partially or completely within a molding. other embodiments may be described and/or claimed.
