Intel Corporation patent applications published on November 30th, 2023

Summary of the patent applications from Intel Corporation on November 30th, 2023

Intel Corporation has recently filed several patents related to various aspects of technology. These patents cover areas such as layer 1 (L1)/layer 2 (L2) triggered mobility (LTM) aspects, electronic device display interfaces for camera control, network interface devices with direct memory access (DMA) circuitry, secure connections over Remote Direct Memory Access (RDMA), software-based management of the physical layer (PHY) of a link, adapting secure sounding signals in communication devices, implementing high-speed Ethernet links using a hybrid PHY, gate-all-around integrated circuit structures with tightly spaced nanowires, and thin film transistors with double gates.

Notable applications of these patents include:

• Layer 1 (L1)/layer 2 (L2) triggered mobility (LTM) aspects, including inter-cell mobility, split architectures, dynamic cell group changes, activation, and deactivation.
• Electronic device display interfaces for controlling a camera and reviewing captured images, providing a simplified and user-friendly interface.
• Network interface devices with direct memory access (DMA) circuitry for processing packets and determining Extended Sequence Number (ESN) values.
• Secure connections over Remote Direct Memory Access (RDMA) with two network interface devices, acting as endpoints for Transport Layer Security (TLS) over RDMA connections.
• Software-based application for managing the physical layer (PHY) of a link using an application programming interface (API) to configure the physical layer through firmware.
• Adapting secure sounding signals in communication devices based on negotiated bandwidth for secure communication.
• Implementing high-speed Ethernet links using a hybrid PHY with non-interleaved or interleaved RS-FEC sublayers, determined during link training.
• Gate-all-around integrated circuit structures with tightly spaced nanowires and methods for fabricating them.
• Thin film transistors with double gates for improved control and performance.

In summary, Intel Corporation has filed patents covering a wide range of technological advancements, including mobility aspects, camera control interfaces, network interface devices, secure connections, software-based management of the physical layer, adaptive sounding signals, high-speed Ethernet links, integrated circuit structures, and thin film transistors. These patents demonstrate Intel's commitment to innovation and advancing technology in various fields.