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| − | '''Summary of the patent applications from Intel Corporation on November 30th, 2023'''
| + | ==Patent applications for Intel Corporation on November 30th, 2023== |
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| − | Intel Corporation has recently filed several patents related to various aspects of technology. These patents cover areas such as layer 1 (L1)/layer 2 (L2) triggered mobility (LTM) aspects, electronic device display interfaces for camera control, network interface devices with direct memory access (DMA) circuitry, secure connections over Remote Direct Memory Access (RDMA), software-based management of the physical layer (PHY) of a link, adapting secure sounding signals in communication devices, implementing high-speed Ethernet links using a hybrid PHY, gate-all-around integrated circuit structures with tightly spaced nanowires, and thin film transistors with double gates.
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| − | Notable applications of these patents include:
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| − | * Layer 1 (L1)/layer 2 (L2) triggered mobility (LTM) aspects, including inter-cell mobility, split architectures, dynamic cell group changes, activation, and deactivation.
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| − | * Electronic device display interfaces for controlling a camera and reviewing captured images, providing a simplified and user-friendly interface.
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| − | * Network interface devices with direct memory access (DMA) circuitry for processing packets and determining Extended Sequence Number (ESN) values.
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| − | * Secure connections over Remote Direct Memory Access (RDMA) with two network interface devices, acting as endpoints for Transport Layer Security (TLS) over RDMA connections.
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| − | * Software-based application for managing the physical layer (PHY) of a link using an application programming interface (API) to configure the physical layer through firmware.
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| − | * Adapting secure sounding signals in communication devices based on negotiated bandwidth for secure communication.
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| − | * Implementing high-speed Ethernet links using a hybrid PHY with non-interleaved or interleaved RS-FEC sublayers, determined during link training.
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| − | * Gate-all-around integrated circuit structures with tightly spaced nanowires and methods for fabricating them.
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| − | * Thin film transistors with double gates for improved control and performance.
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| − | In summary, Intel Corporation has filed patents covering a wide range of technological advancements, including mobility aspects, camera control interfaces, network interface devices, secure connections, software-based management of the physical layer, adaptive sounding signals, high-speed Ethernet links, integrated circuit structures, and thin film transistors. These patents demonstrate Intel's commitment to innovation and advancing technology in various fields.
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| − | ==Patent applications for intel on November 30th, 2023== | |
