Integrated Assemblies and Methods of Forming Integrated Assemblies: abstract simplified (18207499)

From WikiPatents
Jump to navigation Jump to search
  • This abstract for appeared for patent application number 18207499 Titled 'Integrated Assemblies and Methods of Forming Integrated Assemblies'

Simplified Explanation

The abstract describes an integrated assembly that includes different memory regions and an intermediate region. The assembly has a stack made up of conductive and insulative levels. There are channel-material-pillars arranged within the memory regions, memory-block-regions that extend across the memory regions and intermediate region, and staircase regions within the intermediate region. The staircase regions overlap two of the memory-block-regions. There are also first and second panel regions that provide separation between the memory-block-regions. The second panel regions are different in size or composition compared to the first panel regions. The abstract also mentions methods of forming these integrated assemblies.


Original Abstract Submitted

Some embodiments include an integrated assembly having a first memory region, a second memory region, and an intermediate region between the memory regions. A stack extends across the memory regions and the intermediate region. The stack includes alternating conductive levels and insulative levels. Channel-material-pillars are arranged within the memory regions. Memory-block-regions extend longitudinally across the memory regions and the intermediate region. Staircase regions are within the intermediate region. Each of the staircase regions laterally overlaps two of the memory-block-regions. First panel regions extend longitudinally across at least portions of the staircase regions. Second panel regions extend longitudinally and provide lateral separation between adjacent memory-block-regions. The second panel regions are of laterally different dimensions than the first panel regions and/or are compositionally different than the first panel regions. Some embodiments include methods of forming integrated assemblies.