INTERCONNECT STRUCTURE INCLUDING TOPOLOGICAL MATERIAL: abstract simplified (17716485)

• This abstract for appeared for patent application number 17716485 Titled 'INTERCONNECT STRUCTURE INCLUDING TOPOLOGICAL MATERIAL'

Simplified Explanation

The abstract describes a semiconductor device that consists of a substrate and an interconnect layer. The interconnect layer contains a special type of material called a topological material, which can be a topological insulator, a topological semimetal, or a combination of both. The abstract also mentions a method for manufacturing this semiconductor device.

Original Abstract Submitted

A semiconductor device includes a substrate and an interconnect layer disposed over the substrate. The interconnect layer includes an interconnect structure which includes a topological material. The topological material includes a topological insulator, a topological semimetal, or a combination thereof. A method for manufacturing the semiconductor device is also disclosed.