INTEGRATED THERMAL-ELECTRICAL CO-SIMULATION: abstract simplified (17716527)

• This abstract for appeared for patent application number 17716527 Titled 'INTEGRATED THERMAL-ELECTRICAL CO-SIMULATION'

Simplified Explanation

This abstract describes an information handling system that consists of a memory device and a processor. The memory device stores two types of data: the first data represents the thermal profile (temperature characteristics) of a motherboard, and the second data represents a circuit trace on the motherboard. A circuit trace is a high-speed data connection between different circuit devices on the motherboard.

The processor in the system uses the first and second data to determine the average temperature of the circuit trace on the motherboard. It then uses this average temperature to create a model or layout for the circuit trace on the motherboard. In simpler terms, the processor analyzes the temperature information and designs the layout of the circuit trace accordingly.

Original Abstract Submitted

An information handling system includes a memory device and a processor. The memory device includes first data representing a thermal profile of a motherboard, and second data representing a circuit trace of the motherboard. The circuit trace provides a high-speed data interconnection between two or more circuit devices. The processor determines an average temperature of the circuit trace on the motherboard based upon the first data and the second data, and models a trace layout for the circuit trace on the motherboard based upon the average temperature.